Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

01/10/2025 | Micron
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.

American Standard Circuits' John Johnson to Speak at Ultra HDI Symposium

01/06/2025 | American Standard Circuits
Anaya Vardya, president and CEO of American Standard Circuits, announced that his company’s Director of Quality/Advanced Technology, John Johnson, will be speaking at this year’s Ultra HDI Symposium, Jan. 23, in Peoria, Arizona.

Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects

12/12/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Micron Technology up to $6.165 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on April 25, 2024, and the completion of the Department’s due diligence.

SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects

12/11/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.

UHDI Fundamentals: ‘UHDI’ Bleeding-edge Entertainment Applications, Part 1

10/10/2024 | Anaya Vardya, American Standard Circuits
As soon as we cross below the 1-mil (0.001") line width threshold, we need to stop talking in terms of mils and ounces and begin talking in terms of microns. For reference, a 3-mil trace is 75 microns, so a 1-mil trace is 25 microns. In general terms, ultra high density interconnect refers to line and spaces on a printed circuit board that are sub-25 micron. In the context of this article, ultra high-definition interconnect (UHDI) refers to the technology and infrastructure used to transmit and connect ultra high-definition signals, typically 4K, 8K, or even higher resolutions, across devices like displays, cameras, servers, and processors.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in