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Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments

04/03/2025 | Real Time with...IPC APEX EXPO
Erik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.

Electroninks' MOD and iSAP Game Changers

03/25/2025 | Marcy LaRont, PCB007 Magazine
Electroninks, a prominent player in particle-free conductive inks, recently announced an exciting new range of metal-complex inks for ultra high density interconnect (UHDI) technology. At the SMTA UHDI Symposium in January, Mike Vinson, COO of Electroninks, gave a presentation on this line of MOD inks, which are versatile and suitable for a range of applications that require ultra-dense, miniaturized, and high-frequency technology. Mike says his technology is a game changer and will revolutionize UHDI circuit fabrication. 

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/07/2025 | Andy Shaughnessy, I-Connect007
It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we?

Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?

02/19/2025 | Chrys Shea, SHEA Engineering Services
UHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago. 

UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2

02/06/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming.
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