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Nano Labs Invests in AI ASIC Chip Startup, Collaborating with DeepSeek to Drive the Future of AI Technology
January 28, 2025 | PRNewswireEstimated reading time: Less than a minute
Nano Labs Ltd., a leading fabless integrated circuit design company and product solution provider in China, today announced its strategic investment in Hangzhou Weiheng Technology Co., Ltd., obtaining a 5% stake in the company. Weiheng Technology is engaged in the development of AI focused ASIC compute-storage chips for edge and endpoint computing as well as applications for large AI models, and its products can be integrated with DeepSeek's latest large models.
Dr. Jianping Kong, Chairman and CEO of Nano Labs, commented, "The evolution toward cost-performance optimization and practical deployment is expected to accelerate the adoption of AI models across industries such as consumer electronics, embodied intelligence, and intelligent vehicles, propelling the sector toward smarter and more efficient solutions. Looking ahead to 2025, AI technology is poised to spark a new wave of applications in endpoint computing, unlocking vast market potential. With its innovative technologies, our invested startup is well-positioned to thrive in this wave, seize greater opportunities, and continue driving global technological progress."
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Brent Fischthal - Koh YoungSuggested Items
HT Global Circuits Adds Two atg Luther & Maelzer Flying Probe Test Systems
10/15/2025 | atg Luther & Maelzer GmbHAtg Luther & Maelzer GmbH, a leading supplier of electrical testing solutions for the PCB industry, and IEC USA, a distributor of consumables, equipment, and services in the North American PCB market, confirm the order for high-speed bare board testing technology.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
The Marketing Minute: Marketing With Layers
10/15/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing to a technical audience is like crafting a multilayer board: Each layer serves a purpose, from the surface story to the buried detail that keeps everything connected. At I-Connect007, we’ve learned that the best marketing campaigns aren’t built linearly; they’re layered. A campaign might start with a highly technical resource, such as an in-depth article, a white paper, or a podcast featuring an engineer delving into the details of a process. That’s the foundation, the substance that earns credibility.
Elementary, Mr. Watson: High Power: When Physics Becomes Real
10/15/2025 | John Watson -- Column: Elementary, Mr. WatsonHave you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.