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Nano Labs Invests in AI ASIC Chip Startup, Collaborating with DeepSeek to Drive the Future of AI Technology
January 28, 2025 | PRNewswireEstimated reading time: Less than a minute
Nano Labs Ltd., a leading fabless integrated circuit design company and product solution provider in China, today announced its strategic investment in Hangzhou Weiheng Technology Co., Ltd., obtaining a 5% stake in the company. Weiheng Technology is engaged in the development of AI focused ASIC compute-storage chips for edge and endpoint computing as well as applications for large AI models, and its products can be integrated with DeepSeek's latest large models.
Dr. Jianping Kong, Chairman and CEO of Nano Labs, commented, "The evolution toward cost-performance optimization and practical deployment is expected to accelerate the adoption of AI models across industries such as consumer electronics, embodied intelligence, and intelligent vehicles, propelling the sector toward smarter and more efficient solutions. Looking ahead to 2025, AI technology is poised to spark a new wave of applications in endpoint computing, unlocking vast market potential. With its innovative technologies, our invested startup is well-positioned to thrive in this wave, seize greater opportunities, and continue driving global technological progress."
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03/06/2025 | JaltekJaltek are delighted to officially announce that they have joined the Midlands Aerospace Alliance (MAA). The MAA which was formed in 2003 to support and represent the aerospace industry across the Midlands region, now represents one of the largest aerospace clusters in the world and is one of the strongest advocates for both the aerospace industry and the Midlands region.
iMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’
03/05/2025 | Marcy LaRont, I-Connect007It was a cool and sunny morning as I headed out to the iMAPS Device Packaging Conference 2025 in Arizona early Tuesday, which featured two compelling keynote speakers, and a day chocked full of technical sessions. iMAPS 2025 also hosted a sold-out exhibit hall with 65 exhibitors from IBM and Heraeus to Cadence and KYZEN, to name just a few. The technology and packaging discussions at this conference blew my mind last year, and it is clear this year would be no different.
W. Gessmann Showcases Range of Innovative AMR-Solutions at LogiMAT 2025
03/05/2025 | W. Gessmann GmbHThe international trade fair LogiMAT opens its doors in Stuttgart in March 2025, showcasing innovations in intralogistics and process management. W. Gessmann GmbH will present cutting-edge solutions for the intelligent use of AMRs and cobots in industrial intralogistics and workshops at Stand 8D65.
U.S. to Hold Over 20% of Advanced Semiconductor Capacity by 2030, TSMC Expands Investment to $165B
03/05/2025 | TrendForceTrendForce’s latest findings reveal that TSMC has announced it’s increasing investment in U.S. advanced semiconductor manufacturing, bringing the total to US$165 billion.