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Koh Young to Unveil AI Inspection Solutions at NEPCON Asia 2026

10/07/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will unveil its latest inspection platforms and AI-powered process solutions at NEPCON Asia 2026, October 27–29 at the Shenzhen World Exhibition & Convention Center in Shenzhen.

Koh Young Turns Measurement-based Inspection Data into Manufacturing Intelligence at SMTA International 2026

09/29/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will showcase its latest inspection and process optimization technologies at SMTA International 2026 at the Donald E. Stephens Convention Center in Rosemont, Illinois.

3 Key Takeaways: Making ENIG and ENEPIG More Sustainable

09/30/2026 | I-Connect007
Gold prices have risen dramatically over the past decade, putting additional pressure on PCB fabricators to control costs without compromising the finishes their customers require. For ENIG and ENEPIG processes, however, the opportunity to reduce costs may also present an opportunity to improve sustainability. In its white paper, “Can ENIG & ENEPIG Process be Sustainable?” MacDermid Alpha Electronics Solutions provides guidelines for where the greatest opportunities exist to reduce gold consumption, chemistry use, energy demand, and waste while continuing to meet established performance requirements.

Closing the Gap: Measuring 20-µm Spacing in Advanced SiP Packaging

09/18/2026 | Axel Lindloff, Koh Young Europe
Twenty microns does not leave much room for error. As advanced packaging increases functional density, the distance between neighboring devices is shrinking to dimensions that create an entirely new set of inspection challenges. In some system-in-package (SiP) applications, components approximately 200 to 300 µm tall can be separated by gaps of only 20 to 30 µm. Measuring those spaces accurately requires considerably more than simply increasing camera magnification. The challenge is optical access.

Koh Young Brings Advanced Packaging Inspection and Metrology Solutions to SEMICON West 2026

09/15/2026 | Koh Young
Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will showcase its growing portfolio of inspection and metrology technologies for semiconductor and advanced packaging applications at SEMICON West 2026, October 13–15 at the Moscone Center in San Francisco, California.
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