Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages

10/03/2025 | I-Connect007
I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.

EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration

09/12/2025 | EV Group
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM). 

Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India

08/14/2025 | Koh Young
Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.

Adeon Technologies Signs Agreement as Distribution and Service Partner for PMT Global

06/13/2025 | Adeon Technologies BV
Adeon Technologies has signed an agreement as Distribution and Service partner with PMT Global from Germany for its high precision measurement range of products. 

Leidos Using Quantum Technology to Thwart GPS Jamming

06/05/2025 | PRNewswire
Susceptibility to jamming is a significant military vulnerability of the Global Positioning System (GPS) signal. Through a Defense Innovation Unit contract, Leidos is developing an alternative navigation technology that measures variations in the Earth's magnetic field and harnesses the quantum properties of nitrogen in diamonds.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in