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Koh Young Brings Smart AI Solutions to productronica India 2026 South and Expands Regional Presence

08/06/2026 | Koh Young
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will place its Smart AI Solutions at the center of its participation in productronica India 2026 South, September 16–18 at the Bangalore International Exhibition Centre in Bengaluru.

Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026

04/21/2026 | Koh Young America
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.

Pushing Boundaries in Measuring Board Warpage

11/12/2025 | Marcy LaRont, PCB007 Magazine
Akrometrix is a key player in metrology equipment. It focuses on accurately assessing warpage and strain in PCBs and PCBAs and prospers through continuing R&D and local sourcing. I recently met with Neil Hubble, president of Akrometrix, and Paul Handler, director of sales, for a tour of their Georgia facility. We discussed the growing challenge of quality measurement for advanced products and denser designs and the need for industry standardization.

Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages

10/03/2025 | I-Connect007
I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.

EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration

09/12/2025 | EV Group
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM). 
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