-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueTraining New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
ioTech’s io600 Wins Prestigious EIC Accelerator Award for Semiconductor Innovation
January 31, 2025 | ioTechEstimated reading time: 1 minute
Reophotonics Ltd, a member of the ioTech group, is proud to announce it has received the highly prestigious EIC Accelerator Award from the European Innovation Council (EIC) and SMEs Executive Agency (EISMEA). This recognition highlights the transformative impact of the io600 Digital Deposition System on semiconductor manufacturing.
The EIC jury praised the io600 as a “game-changer,” citing its ability to strengthen and scale up production and innovation across Europe’s semiconductor value chain. This award aligns with the ambitious objectives of the European Chips Act, which aims to bolster Europe’s competitiveness in the global semiconductor market through innovation, sustainability, and advanced manufacturing capabilities.
“The io600 responds to market needs,” the jury stated. “It will enable further miniaturization, realize features and structures currently impossible to manufacture” and “it will significantly increase throughput, yield, and sustainability.”
By addressing these critical industry challenges, the io600 empowers manufacturers to unlock faster, more accurate, and environmentally friendlier production processes. Its ability to create structures that traditional methods cannot produce marks a significant step forward for semiconductor innovation.
“This award testifies to our commitment to push the boundaries of semiconductor packaging,” said Hervé Javice, CEO of ioTech Reophotonics. “The cutting-edge io600 is perfectly aligned with the objectives of the European Chips Act, and we are proud to play a key role in strengthening Europe’s semiconductor capabilities.”
Reophotonics congratulates the other award recipients and looks forward to further advancing electronics manufacturing through the io600’s revolutionary technology.
Suggested Items
Global Semiconductor Sales Increase 17.9% Year-to-Year in January
03/07/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales hit $56.5 billion during the month of January 2025, an increase of 17.9% compared to the January 2024 total of $47.9 billion and 1.7% less than the December 2024 total of $57.5 billion.
Teradyne Announces Succession Plan for Semiconductor Test Division
03/07/2025 | BUSINESS WIRETeradyne, Inc. announced that Shannon Poulin has joined Teradyne to succeed Rick Burns as President of the Semiconductor Test Division in Q2 2025. Mr. Burns plans to retire on June 1, 2025.
SEMICON China 2025 to Highlight Key Opportunities and Challenges in Advancing Semiconductor Industry Growth
03/07/2025 | SEMISEMICON China 2025 will gather industry visionaries and leaders from March 26-28 at the Shanghai New International Expo Centre to delve into the latest developments, trends, and innovations in key areas crucial for propelling industry growth to $1 trillion by 2030.
Infineon Launches Automotive-Grade RISC-V Microcontroller Family
03/06/2025 | InfineonInfineon Technologies AG leads the way for the adoption of RISC-V in the automotive industry: The company will launch a new automotive microcontroller family based on RISC-V within the coming years.
Drip by Drip: Semiconductor Water Management Innovations
03/05/2025 | IDTechExNot only does semiconductor manufacturing require large volumes of energy, chemicals, and silicon wafers, it also requires vast volumes of water. IDTechEx’s latest report, “Sustainable Electronics and Semiconductor Manufacturing 2025-2035: Players, Markets, Forecasts”, forecasts water usage across semiconductor manufacturing to double by 2035, as demand for integrated circuits continues to rise.