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Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
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TEXMAC/Takaya Appoints Arrowhead as New Rep in Arizona
February 14, 2025 | TEXMACEstimated reading time: Less than a minute
TEXMAC, the exclusive authorized distributor of Takaya flying probe test systems in North and South America, announces the appointment of Arrowhead Technical Sales & Marketing, LLC and Brian L. Crisp to represent the company’s flying probe test systems and technology in the state of Arizona.
Brian L. Crisp is an accomplished sales professional with over 25 years of sales experience. Brian’s approach is solutions oriented, which has benefited customers in high-tech, medical, and military electronics.
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Henger to Showcase AI‑Era Plasma Solutions at APEX EXPO 2026
03/11/2026 | HengerHenger will be exhibiting at APEX EXPO 2026 to present its latest plasma treatment solutions designed for the AI‑driven generation of high‑speed, high‑density PCB manufacturing.
Milwaukee Electronics’ US Facilities Now AS9100 Certified
03/11/2026 | Milwaukee ElectronicsMilwaukee Electronics announced that its facilities in Portland, OR and Milwaukee Electronics have both completed the registration process for AS9100:2016.
Atg-Luther Maelzer to Exhibit at APEX EXPO 2026
03/09/2026 | atg Luther & Maelzer GmbHatg Luther & Maelzer GmbH and their partner International Electronic Components Inc (IEC) are looking forward to meeting with attendees at the upcoming IPC-APEX trade show in booth 4844 on March 17 – 19 at the Convention Center in Anaheim, CA.
STMicroelectronics Expands Silicon Photonics Production for AI Demand
03/09/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters.
YINCAE's TM230D Introduced: Innovative 3-in-1 Solderable Adhesive
03/06/2026 | YINCAEA breakthrough in advanced packaging materials has arrived with the introduction of TM230D, an innovative 3-in-1 sintering material designed to simplify processing while delivering exceptional thermal & reliability performance for next-generation power electronics & high-performance semiconductor applications.