Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
Target Condition: The 5 Ws of PCB Design Constraints
Fresh PCB Concepts: More Than Compliance—A Human-centered Sustainability Approach
TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
March 13, 2025 | TSMCEstimated reading time: 1 minute
MediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process. This achievement makes it possible to integrate these two essential components into a system-on-chip (SoC) on an advanced RF process for wireless connectivity products, enabling a significantly smaller form factor while enjoying performance competitive with stand-alone modules.
The smaller area enabled by TSMC’s advanced N6RF+ technology can reduce the size of the wireless connectivity product module by a double-digit percentage. In addition, TSMC and MediaTek’s results showed significant improvement in power efficiency for the PMU compared with existing solutions, while iPA performance was competitive with benchmark products. As the world’s leading supplier of wireless connectivity solutions, MediaTek is well positioned to leverage these advancements to ensure top product performance as it shifts towards the next generation.
A direct result of MediaTek and TSMC’s close collaboration on Design-Technology Co-Optimization (DTCO), MediaTek drew on its product and design expertise to drive system specifications and technology requirements for this project, and TSMC enhanced its technology to enable differentiation in the products.
“After a year of working together on N6RF+, the test chip has exhibited excellent power efficiency gains," said Ching San Wu, Corporate Vice President at MediaTek. "By combining MediaTek's leadership in wireless technology and TSMC's expertise on DTCO, N6RF+ will become a competitive technology for RFSoC projects, creating a significant advantage in the industry."
“Successful DTCO between foundry and customer requires strong mutual trust and teamwork, and we are delighted in this joint accomplishment with a wireless connectivity leader like MediaTek,” said Lipen Yuan, senior director of Advanced Technology Business Development at TSMC. “This achievement on TSMC’s N6RF+ process shows how TSMC combines its leadership in advanced logic and broad portfolio of specialty technologies to provide differentiated solutions for customers’ products.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services
07/31/2025 | Global Electronics AssociationThe Global Electronics Association (formerly IPC International Inc.) announces the appointment of Brent Laufenberg as its new Chief Information Officer (CIO).
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
ViTrox’s HITS 5.0 Empowers Global Partners with Innovative Solutions and Stronger Bonds
07/16/2025 | ViTroxViTrox, strives to be the World’s Most Trusted Technology Company, proudly announces the successful conclusion of its fifth edition of High Impact Training for Sales (HITS 5.0), held from 23rd to 27th June 2025 at ViTrox Campus 2.0 and 3.0, located in Batu Kawan Industrial Park, Penang, Malaysia.
Global Citizenship: The Global Push for Digital Inclusion
07/16/2025 | Tom Yang -- Column: Global CitizenshipIt can be too easy to take the technology at our fingertips for granted: high-speed internet, cloud-based collaboration, and instant video calls across continents. Yet, for billions of people, access to these digital tools is a distant dream. As a global community, we must ensure that technology is available to all. Here is how technology is bridging physical, economic, and educational gaps in underserved regions and profoundly reshaping lives.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.