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High Density Packaging User Group Announces ASKPCB Membership
November 3, 2025 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
“ASKPCB and Sundell are thrilled to join the HDP User Group,” said Fred Hickman, VP of North America Sales. “As part of our continuous drive toward innovation and collaboration, HDP provides an ideal platform to work alongside global leaders in the Technology field. With our new smart-factory operations in Sundell (Thailand facility), we look forward to contributing to HDP initiatives that advance next-generation PCB design, materials and manufacturing processes – while strengthening partnerships across the electronics supply chain.”
I am pleased to welcome ASKPCB to HDP, joining the outstanding organization working on HDP User Group projects. Their expertise and understanding of complex PCB fabrication for high-performance applications will support many HDP projects. They will contribute significantly to our advanced reliability assessment projects," said Larry Marcanti, Executive Director of HDP User Group.
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High Density Packaging User Group Announces European Space Agency Membership
11/04/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
High Density Packaging User Group Announces Dynamic Electronics Membership
10/14/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.
Real Time with… IPC APEX EXPO 2024: The HDP User Group's Role in the Electronics Industry
05/22/2024 | Real Time with...IPC APEX EXPOBev Christian, a project facilitator from the HDP User Group, outlines the consortium's focus on new materials and reliability in the electronics industry, and their collaboration on non-proprietary projects. Key areas of interest include corrosion, PFAS, and lead-free solders. Bev also highlights the value of collaboration and mentions partnerships with other consortia. The HDP User Group welcomes interested individuals to get involved via their website.
High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership
05/20/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member.