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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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EIPC Summer Conference 2025: Call for Distinguished Speakers in Edinburgh
March 26, 2025 | EIPCEstimated reading time: Less than a minute
The European Institute of Printed Circuits (EIPC) is pleased to announce its Summer Conference 2025, scheduled for June 3-4 in the historic city of Edinburgh, Scotland. The EIPC is seeking distinguished speakers to contribute to this premier event, which will gather industry experts, innovators, and thought leaders for 1.5 days of in-depth lectures and discussions on cutting-edge topics in the PCB industry.
The conference will cover a wide range of critical areas, including PCB design, modeling, simulation, manufacturing technology, AI computing, environmental responsibility and eco-friendly manufacturing, reliability, and traceability by application. EIPC welcomes speakers who can provide valuable insights and expertise in these fields.
Edinburgh, the capital of Scotland, offers a unique and inspiring setting for the conference. With its rich historical and cultural heritage, world-class universities, and thriving technological sector, the city provides an ideal environment for fostering innovation and collaboration.
The EIPC invites industry professionals to share their knowledge and contribute to the success of the Summer Conference 2025.
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