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EIPC Summer Conference 2025: Call for Distinguished Speakers in Edinburgh
March 26, 2025 | EIPCEstimated reading time: Less than a minute
The European Institute of Printed Circuits (EIPC) is pleased to announce its Summer Conference 2025, scheduled for June 3-4 in the historic city of Edinburgh, Scotland. The EIPC is seeking distinguished speakers to contribute to this premier event, which will gather industry experts, innovators, and thought leaders for 1.5 days of in-depth lectures and discussions on cutting-edge topics in the PCB industry.
The conference will cover a wide range of critical areas, including PCB design, modeling, simulation, manufacturing technology, AI computing, environmental responsibility and eco-friendly manufacturing, reliability, and traceability by application. EIPC welcomes speakers who can provide valuable insights and expertise in these fields.
Edinburgh, the capital of Scotland, offers a unique and inspiring setting for the conference. With its rich historical and cultural heritage, world-class universities, and thriving technological sector, the city provides an ideal environment for fostering innovation and collaboration.
The EIPC invites industry professionals to share their knowledge and contribute to the success of the Summer Conference 2025.
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Eltek Ltd. Reports Strong Second-Quarter 2025 Results
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20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.
Federal Electronics Elevates Hermosillo Facility with Advanced Mycronic 3D AOI System
08/12/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its new production line at its Hermosillo, Mexico facility with the addition of the Mycronic MYPro i50 Automated Optical Inspection (AOI) system.
Flex Delivers Advanced Power Management for Next-Generation NVIDIA AI Infrastructure
08/07/2025 | FlexFlex announced a new power shelf system to fast-track 800 VDC power architectures and support the growing demands of AI infrastructure and AI factories.
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.