-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
April 2, 2025 | BEST Inc.Estimated reading time: 1 minute
BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
StencilQuik™ is custom-made to match the exact specifications of your components to ensure perfect alignment during rework. The stencil remains securely in place throughout the rework process, becoming an integral part of the PCB assembly. Manufactured from polyimide film with a high-temperature adhesive, this material resembles what is commonly used for bar code labels and for protecting gold fingers during wave soldering. StencilQuik™ is ESD-safe and has a residue-free adhesive backing that ensures a clean application.
An added benefit from this unique product is the ability to overcome solder mask damage which can occur during component removal. StencilQuik™ was designed to be placed over these damaged areas without the need for repair and still result in a successful component placement.
The StencilQuik™ rework process involves a few simple steps starting with preparing the rework site by removing any residual solder or flux residue following BGA removal. Next, remove the adhesive backed stencil and place it on the rework site by aligning the apertures with the corresponding pads. Once properly aligned, use a squeegee to fill each aperture completely with solder paste. After cleaning the residual paste off the stencil, place the component on top of StencilQuik™ and reflow for final placement.
As part of the IPC 7711 BGA rework processes, StencilQuik™ rework stencils have undergone extensive reliability testing confirming their dependability. Furthermore, third-party studies have validated that the surface insulation resistance (SIR) characteristics of BGAs placed using StencilQuik™ stencils, meet the acceptable standards for SIR values on PCB assemblies.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.
BEST Inc. Provides High-Reliability BGA Reballing and Component Rework Services
08/22/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce its component rework services are available for all types of area array devices including ball grid array, land grid array and quad flat no-lead SMT packages.