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BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
April 2, 2025 | BEST Inc.Estimated reading time: 1 minute
BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
StencilQuik™ is custom-made to match the exact specifications of your components to ensure perfect alignment during rework. The stencil remains securely in place throughout the rework process, becoming an integral part of the PCB assembly. Manufactured from polyimide film with a high-temperature adhesive, this material resembles what is commonly used for bar code labels and for protecting gold fingers during wave soldering. StencilQuik™ is ESD-safe and has a residue-free adhesive backing that ensures a clean application.
An added benefit from this unique product is the ability to overcome solder mask damage which can occur during component removal. StencilQuik™ was designed to be placed over these damaged areas without the need for repair and still result in a successful component placement.
The StencilQuik™ rework process involves a few simple steps starting with preparing the rework site by removing any residual solder or flux residue following BGA removal. Next, remove the adhesive backed stencil and place it on the rework site by aligning the apertures with the corresponding pads. Once properly aligned, use a squeegee to fill each aperture completely with solder paste. After cleaning the residual paste off the stencil, place the component on top of StencilQuik™ and reflow for final placement.
As part of the IPC 7711 BGA rework processes, StencilQuik™ rework stencils have undergone extensive reliability testing confirming their dependability. Furthermore, third-party studies have validated that the surface insulation resistance (SIR) characteristics of BGAs placed using StencilQuik™ stencils, meet the acceptable standards for SIR values on PCB assemblies.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
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08/22/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce its component rework services are available for all types of area array devices including ball grid array, land grid array and quad flat no-lead SMT packages.
A.R.T. Ltd. Nominated in Four Categories at 2025 Instrumentation and Electronics Industry Awards
08/11/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T. Ltd.), a leading provider of electronics training and consultancy, has been shortlisted in four categories at the 2025 Instrumentation and Electronics Industry Awards, including Industry Personality, Academic Support, Rising Star, and Best Customer Service.
Automated Production Equipment and Manncorp Announce Strategic Partnership to Expand SMT Solutions for U.S. Electronics Manufacturers
08/06/2025 | Automated Production EquipmentAutomated Production Equipment (APE), a trusted supplier of high-performance soldering and rework systems, proudly announces a strategic partnership with Manncorp, a leading provider of Surface Mount Technology (SMT) production equipment. This collaboration brings together two industry leaders to deliver expanded, end-to-end SMT solutions to electronics manufacturers across North America.
Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.