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Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions from Rehm
April 3, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute

Michael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges. Ongoing software development is crucial for future-proofing solutions. Michael also introduces vapor phase soldering technology, which provides energy savings and innovative flux-free pastes, leading to high customer acceptance due to secure, time-saving solutions.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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October 2025 SMT007 Magazine: Upgrading Your Production Software
10/01/2025 | I-Connect007 Editorial TeamEMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone? The October 2025 issue of SMT007 Magazine investigates business operations software and how best to achieve the necessary integrations.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
Bittium Launches Embedded AI Offering and Announces Collaboration with Qualcomm
09/23/2025 | BittiumBittium announces the launch of new Embedded AI offering, delivering intelligent on-device solutions for the telecommunication, IoT, defense, and satellite communication markets.
Siemens Accelerates Complex Semiconductor Design and Test with Tessent IJTAG Pro
09/22/2025 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced Tessent™ IJTAG Pro software, which will transform IJTAG (IEEE 1687) input/output by enabling parallel operations of the traditionally serial operation and provide read and write access to custom hardware.
Siemens, TRUMPF Partner to Accelerate Digital Manufacturing and AI Readiness
09/16/2025 | SiemensTechnology company Siemens and leading machine tools and laser manufacturer TRUMPF announced a partnership that promises to elevate industrial production by harnessing advanced digital manufacturing solutions.