-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Laird Thermal Systems Unveils New Identity
May 5, 2025 | Laird Thermal SystemsEstimated reading time: 1 minute
Laird Thermal Systems, a global leader in active thermal management solutions with more than 60 years of application expertise, today announced its rebrand to Tark Thermal Solutions. This name change marks a significant new chapter for the company following the expiration of the previous Laird Name License Agreement. This was the perfect time for a new name and brand design that elevates our identity to match the excellence of our work.
With one of the most diverse product portfolios in the industry, including thermoelectric coolers and assemblies, temperature controllers, specialty pumps and liquid cooling systems, Tark Thermal Solutions leverages advanced thermal modeling techniques to solve complex challenges in heat and temperature control. The rebranding underscores the company’s expanded capabilities, sharpened mission, and unwavering commitment to delivering exceptional thermal management solutions to customers worldwide.
A Vision for Innovation and Excellence
Tark Thermal Solutions remains firmly committed to its corporate purpose: Advancing technology for a protected and connected future. As a trusted partner in the development and production of innovative active thermal management solutions, the company serves a wide range of industries including medical, analytical, industrial, transportation, data center and telecommunications markets.
Core Values and Strategy
At the heart of Tark Thermal Solutions are the values of transparency, synergy, ambition, and adaptability. These principles shape both internal culture and external relationships with customers, partners, and communities. The company’s brand strategy provides clear direction and messaging, supporting the development of human-centered, relationship-driven technological solutions.
“We are excited about this new chapter and the opportunities it brings to strengthen our partnerships and make a lasting impact across the industries we serve," said Max Kley, CEO of Tark Thermal Solutions.
“Our rebranding to Tark Thermal Solutions represents a major milestone in our journey to redefine our identity," said Christoph Bauckhage, Chief Sales Officer at Tark Thermal Solutions. "By focusing on customer needs, we will continue to deliver innovative thermal solutions that enhance performance, reliability, and enable continuous operation — all while contributing to a sustainable future," he added.
Suggested Items
2025 COMPUTEX Compal Unveils 'The Race is On' Strategy During Forum Session
05/23/2025 | Compal Electronics Inc.As AI models and computing density continue to grow at an exponential rate, the data center industry is entering a new era where cooling capacity has become the next competitive threshold.
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.
Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025
05/19/2025 | Indium CorporationAs a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,