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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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Imec Coordinates EU Chips Design Platform
May 9, 2025 | ImecEstimated reading time: 1 minute
A consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform. Funded by Chips JU, the platform will facilitate access to advanced semiconductor design infrastructure, training, and capital for fabless semiconductor startups, small and medium enterprises and research organizations. By providing the necessary resources, the initiative aims to democratize and foster semiconductor innovation across Europe, specifically for chip design.
The semiconductor industry is the backbone of modern technology, powering everything from smartphones to advanced medical devices. With the EU Chips Act, Europe is dedicated to increasing its global semiconductor market share. Next to the launch of European pilot lines that aim to develop key technologies for semiconductor innovation, the EU Chips Act has proposed the EU Chips Design Platform as a vehicle to support the growth of fabless chip companies in Europe.
The EU Chips Design Platform will enable fabless companies to access the resources they need quickly and efficiently via a cloud-based virtual environment, offering chip design resources, training, and capital. Coordinated by imec, twelve key European research players in the semiconductor ecosystem have joined forces in a consortium to create this design platform.
The platform aims to onboard the first startups and small and medium enterprises by early 2026, providing them with low-barrier access to European design capabilities, including route-to-chip fabrication, packaging, and testing. It will offer customized support to access commercial electronic design automation (EDA) tools, intellectual property (IP) libraries, EU Chips Act pilot line technologies, and access to design IP repositories, including open-source options. Additionally, the platform will feature a startup support program with incubation, acceleration, and mentoring activities next to financial assistance to help early-stage companies turn their innovative ideas into reality.
“The EU Chips Design Platform will provide crucial resources for startups and SMEs to accelerate their design journey and bring their business ideas to market faster. By reducing the barriers to access of design expertise, including EDA tools and IP, and drastically lowering chip design and fabrication costs and time-to-market, we will spark the growth of the European chip design industry,” stated Romano Hoofman, imec project coordinator.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
The Right Blend: Mixed Wireless Technologies
05/08/2025 | Kirsten Zima, Siemens EDAA common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.