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IIT Kharagpur, A*STAR Singapore Forge Strategic Partnership to Advance Semiconductor Innovation in Asia
June 3, 2025 | IIT KharagpurEstimated reading time: 2 minutes
In a landmark move to foster global collaboration in semiconductor research and talent development, IIT Kharagpur has signed a Memorandum of Understanding (MoU) with the Institute of Microelectronics (IME) under Singapore’s Agency for Science, Technology and Research (A*STAR). The announcement was made during SEMICON Southeast Asia 2025, where IIT Kharagpur represented India’s academic and technological prowess in the semiconductor domain.
This partnership underscores the shared commitment of India and Singapore to build a resilient, innovative, and skilled semiconductor ecosystem through international collaboration. IIT Kharagpur, India’s premier institution for science and technology, brings decades of expertise in microelectronics, chip design, nano-fabrication, and advanced materials, making it a key technical partner in this alliance.
As India scales its ambitions in semiconductor manufacturing and R&D, this collaboration positions IIT Kharagpur at the forefront of global initiatives aimed at strengthening semiconductor value chains. The MoU opens new avenues for joint research in Advanced CMOS and post-CMOS technologies; Heterogeneous integration and packaging; AI hardware accelerators; Next-generation memory systems; Photonics and quantum devices; Chip reliability, Thermal Management and Failure Analysis. The collaboration also supports exchange programmes for students and researchers, knowledge-sharing workshops, and co-development of training modules to develop future-ready semiconductor talent.
Prof. Anandaroop Bhattacharya, Dept. of Mechanical Engineering, IIT Kharagpur stated, “This MoU with A*STAR IME marks a significant step in IIT Kharagpur’s global ambition to drive semiconductor innovation. As India rapidly moves to become a semiconductor hub, academia-industry-government collaborations like this will be crucial in building a robust, self-reliant, and globally competitive semiconductor ecosystem.”
Prof. Yeo Yee Chia, Deputy Chief Executive (Innovation & Enterprise) at A*STAR commented, “Singapore's semiconductor ecosystem is built on strong collaborations between public agencies, academia, and industry partners. The Innovate Together event exemplifies our commitment to fostering these partnerships and accelerating innovation to address industry challenges and capture new opportunities in the global semiconductor landscape.”
The signing was part of A*STAR’s broader initiative to connect with international institutions, including partners from Uzbekistan and Singapore’s own semiconductor industry. The Innovate Together event held alongside SEMICON Southeast Asia 2025 highlighted the importance of cross-border collaborations in addressing complex challenges in semiconductor manufacturing, design, and integration.
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More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors
05/13/2026 | Michigan Tech Electronics HubThe energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.
Intel Foundry Push Gains Momentum With Apple as Potential Customer
05/13/2026 | I-Connect007 Editorial TeamApple’s reported decision to tap Intel as a manufacturing partner for future chips could mark one of the most significant shifts in the semiconductor supply chain in years, with implications that extend well beyond consumer electronics.
SEMI: Global Semiconductor Materials Market Revenue Reaches Record $73.2 Billion in 2025
05/13/2026 | SEMIGlobal semiconductor materials market revenue increased 6.8% year-over-year to $73.2 billion in 2025, SEMI, reported in its Materials Market Data Subscription (MMDS).
yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
05/11/2026 | PRNewswireBoard-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.