Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging

04/16/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.

Nolan’s Notes: Wire Harness—The Underdog of the Industry

04/01/2026 | Nolan Johnson -- Column: Nolan's Notes
My dad’s favorite cartoon character was “Underdog,” one of the very first American Saturday morning cartoon shows. When someone asked him for help, Underdog would proudly declare, “Never Fear! Underdog is here!” Over time, I learned that “underdog” had a wider, more socially poignant meaning than just the name of a cartoon superhero. These stories about underdogs kept coming to mind while working on this issue about the challenges facing the wire harness industry. The product is not exactly glamorous and is often treated as an afterthought, but it is most certainly critical to the system.

Global Electronics Association Advocacy Update

03/24/2026 | Real Time with... APEX EXPO
Chris Mitchell, chief advocacy officer for the Global Electronics Association, details the association's enhanced advocacy and industry intelligence initiatives, including new hires and improved data analysis. He discusses critical global trade issues, recent tariff rulings, and the importance of strengthening North America's electronics ecosystem through USMCA collaboration.

I-Connect007 Magazine: AI, Tolerances, Flexible Circuits, and More

03/17/2026 | I-Connect007 Editorial Team
In the spirit of March Madness, the latest issue of I-Connect007 Magazine tackles a full bracket of topics engineers face on real boards, from AI-powered design tools and cumulative tolerances to copper pours, etch factors, flexible circuits, and solder mask details.

Marcy’s Musings: Our Own March Madness

03/18/2026 | Marcy LaRont -- Column: Marcy's Musings
I spend a lot of time looking ahead, whether that's toward future technology, market needs, or even the future of my editorial calendar. The industry is looking ahead as well. Every year at APEX EXPO, for example, participants get a clearer look at where we’re headed over the next three to five years. In fact, as our March issue is published, we will be in the throes of another great show (our own version of March Madness).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in