-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Altus: New 3D AOI Inspection System Drives Efficiency and Precision for PCBA Specialist
June 24, 2025 | Altus GroupEstimated reading time: 2 minutes

Altus Group, a leading distributor of electronics manufacturing equipment in the UK and Ireland, has supplied Alan Anderson Manufacturing, a growing electronic manufacturing services provider, with a state-of-the-art 3D Automated Optical Inspection (AOI) system. This advanced solution is designed to align with their increasing production needs, enhancing inspection precision, streamlining efficiency, and further strengthening their commitment to quality control.
As AA Manufacturing’s operations have grown significantly, they recognised the need for more advanced inspection technology to keep up with the increasing complexity of their products. After consulting with Altus for expert guidance, they decided to invest in the Koh Young Zenith Alpha HS+ 3D AOI system. While their previous system, a benchtop AOI had performed well, this new system allows them to meet the higher demands for inspection precision and efficiency, ensuring their continued commitment to the highest level of quality control while streamlining production processes and ultimately increasing capability.
Phil Bray, Managing Director at Alan Anderson Manufacturing, said: "The reputation of Koh Young and Altus in the market is clearly outstanding; a glance at their recent news and extensive partner list confirms they are a stand out in the technology. For us, the decision to invest in the market’s leading 3D AOI solution is driven by a commitment to quality, not simply to catch non-conformities, but to equip our team with the tools needed to measure deviations from perfection and ultimately drive yield improvements. Our customer expect best in class, and that is what we are committed to deliver."
The Koh Young Zenith Alpha HS+ offers fully automated 3D inspection with advanced features such as high-speed processing and precise SPC analysis, providing 100% inspection coverage up to 25mm in full 3D metrology. It ensures micron-level precision across all components, while integrated KSMART software enables real-time data analysis, helping optimize production processes and improve yield.
Joe Booth, CEO of Altus Group, commented, “Alan Anderson Manufacturing is a dynamic company making smart investments to drive growth and have taken the market by storm over the last years. We’re very pleased to support them with another successful project and their new 3D AOI solution, which will no doubt strengthen their offering to their customers, and position in the UK CEM market.”
With this cutting-edge inspection technology in place, Alan Anderson Manufacturing is now well-positioned to scale its operations while maintaining its commitment to exceptional quality control standards.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Arc-Tronics Strengthens Inspection Capabilities with Three New Saki AOI Systems
09/26/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce that Arc-Tronics, Inc., a high-reliability EMS provider based in Elk Grove Village, Illinois, has recently installed three 3Di-LS3 Series Automated Optical Inspection (AOI) systems in its production facility.