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Getting Our ‘Fil’ of Design Constraint Techniques
August 7, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute

Setting design constraints is one of the most critical parts of the PCB design process. The PCB designer must balance performance, manufacturability, and cost while addressing issues such as component function, signal integrity, thermal management, and EDA tool idiosyncrasies.
Filbert Arzola is a principal electrical engineer at Raytheon SAS and an instructor who teaches one of the few classes (that I know of) that focuses on setting design constraints. I asked Fil to share his thoughts on design constraints: the factors involved, the various trade-offs, and his best practices for optimizing constraints for your particular design. As Fil says, “Everything about a PCB is a constraint.”
What sort of pre-layout analysis should be performed before you begin setting constraints?
Filbert Arzola: When starting a new PCB board design, one must set up initial routing and clearance constraint settings to enable a good start to engineer your board design. However, one must first review and settle on the initial mechanical model that will house your board design. I highly advise every PCB board engineer to fully understand and confirm the mechanical aspects of the housing, including the outline, the amount and size of the mounting hole clearances, the type and size of the bolt and washer hardware, and most of all, if there are any 3D interferences. A nice DXF file that details all this information completes the electronic model to pre-analyze the mechanical aspect of the board design. One must understand why we constrain our designs and what doing so will give us in return. Having a solid, well-designed, and engineered mechanical model is a must to constrain a successful PCB model database.
To continue reading this interview, which originally appeared in the July 2025 issue of Design007 Magazine, click here.
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Global Excellence in PCB Design: The Global Electronics Association Expands to Italy
08/07/2025 | Global Electronics AssociationIn today's rapidly evolving electronics industry, printed circuit boards (PCBs) serve as the critical backbone influencing the success, reliability, and time-to-market of countless products. Recognizing this essential role, the Global Electronics Association (formerly IPC), a worldwide leader in electronics standards, certification, and education, is now expanding its internationally acclaimed PCB design training to Italy.
Siemens Transforms Customer Engagement for Electronic Component Manufacturers with PartQuest Design Enablement
08/06/2025 | SiemensSiemens Digital Industries Software today announced the launch of the PartQuest™ Design Enablement portfolio, a new, connected digital environment for electronic component manufacturers looking to scale smarter, more personalized and persistent engagement with their customers and prospects.
Review: PCEA Orange County Summer Meeting
08/06/2025 | Dan Feinberg, Technology Editor, I-Connect007The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership. PCEA regularly hosts events to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.
Circuit Check Acquires Solution Sources Programming (SSP) to Become a Full-Service Test and Programming Provider with Expanded Presence in Silicon Valley
08/05/2025 | PR NewswireCircuit Check, a global leader in turnkey functional test systems across medical, automotive, industrial, military/aerospace, and emerging AI applications, today announced the acquisition of Solution Sources Programming (SSP), a trusted Silicon Valley provider of integrated test and programming solutions for over 35 years.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.