-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
What EMS Firms Want From Their Software—and What They Get
September 3, 2025 | Thiago Guimaraes, Global Electronics AssociationEstimated reading time: 1 minute
Last November, the Global Electronics Association [as IPC] surveyed EMS and OEM companies to better understand the software tools driving their operations and uncover trends in adoption, satisfaction, and challenges.
The survey assessed software tools across critical functions, including ERP, MES, PLM, QMS, LMS, quoting systems, and CRM. Participants shared insights on tool adoption, satisfaction, and selection priorities.
A total of 82 qualified individuals completed the survey. Respondents spanned EMS and OEM organizations across North America, Europe, Asia, and the Middle East/Africa, with company revenues ranging from under $5 million to over $1 billion.
This article offers a first look at findings from the 2024 EMS Software Survey, which explores how electronics manufacturers select, implement, and assess core business software. The full report, slated for release later this summer, will include detailed benchmarking data and perspectives on satisfaction, integration, and legacy system challenges.
Aging Infrastructure, Rising Expectations
In electronics manufacturing, digital tools often stick around long past their prime. Nearly 60% of ERP and QMS systems have been in place for over a decade, anchoring operations while complicating efforts to modernize.
MES tools show a similar age profile, but with lower adoption and less functionality—revealing a sector still wrestling with paper-based processes, disconnected systems, and limited visibility. As the industry sets its sights on AI, automation, and real-time traceability, the question isn’t just which systems to adopt, but how to navigate the opportunity cost of updating these well-entrenched legacy systems.
To continue reading this article, which originally appeared in the August 2025 issue of SMT007 Magazine, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance
05/14/2026 | Chandra Gupta -- Column: Below the SurfaceIf you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.
Protecting Advanced Trucking Electronics in Harsh Environments
05/13/2026 | Beth Massey, MacDermid Alpha Electronics SolutionsFor decades, trucking was defined by horsepower, payload, and driver endurance. Today, the competitive edge lies in electronics, as advanced sensing, communications, and data processing systems reshape how commercial vehicles operate. The industry is rapidly digitizing, with electronic systems now critical to safety, uptime, and fleet efficiency. Technologies like ADAS, radar, lidar, and telematics enable real-time decision-making, while distributed sensors monitor key vehicle functions. Because these systems operate in harsh conditions, environmental protection using potting, coatings, and encapsulation is now a core design priority.