Driving Innovation: Selecting the Right Laser Source
Dan’s Biz Bookshelf: ‘Notorious: Leadership Lessons From History’s Most Notorious Leaders’ (New Audio Version)
It's Only Common Sense: See Your Marketing as a Discipline, Not a Department
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
September 8, 2025 | I-Connect007Estimated reading time: Less than a minute
In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Optimize the InterconnectSM series explores how MKS is reshaping microvia formation to meet the challenges of today’s most advanced HDI PCB and substrate designs.
Listeners can also download a free companion guide for a deeper technical dive into unified via formation. The guide includes case studies that showcase the measurable performance gains of OTI in action.
Stay tuned—the final episode in the series is scheduled to air September 18.
Share on:
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
Design for Test: A New Book from The Test Connection, Inc.
04/23/2026 | Real Time with... APEX EXPOBert Horner, president of The Test Connection Inc., shares insights on designing for testability (DFT) challenges with Kelly Dack. Horner discusses the critical need for incorporating testability early in the design process and the importance of quantifiable metrics for measuring test coverage. He highlights The Test Connection's role in transferring decades of 'tribal knowledge' to emerging engineers through training and education. Look for "The Printed Circuit Assembler's Guide to... Design for Test, A Practical Guide to Test and Inspection" in the I-007eBooks library.
Introducing FKN Systek Depanelizer with Linear Guide Table for Small PCBs
04/20/2026 | FKN SystekSingulating small PCBs with circular blade depanelizers can be a tedious repetitive process which can easily result in board damage due to operator fatigue. Increase process quality and safety by using the FKN Systek K2010 motorized circular blade depanelizer with a support table to separate the V-Scored boards.
What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience
04/16/2026 | I-Connect007 Editorial TeamI-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the release of Episode 5, which shifts focus to one of the industry’s most urgent challenges: supply chain resilience.
Vuzix Ships Follow-On Production Order from Major Defense Customer for Waveguide-Based AR
04/06/2026 | PRNewswireVuzix® Corporation, a leading supplier of AI-powered smart glasses, waveguides, and augmented reality technologies, announced that it has received and shipped against a new six-figure follow-on production order for waveguide-based AR display systems from a U.S.-based company that is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry.
Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics
03/18/2026 | I-Connect007I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. As electronics grow more complex, geometries shrink, and packaging densities increase, traditional testing and inspection methods are no longer sufficient. In this timely new release, industry expert Bert Horner of The Test Connection, Inc. provides a practical roadmap for integrating design for test (DFT) into PCB and CCA development, beginning at schematic capture and layout, rather than treating testing as an afterthought.