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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/31/2025 | Nolan Johnson, I-Connect007
Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.

Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly

10/27/2025 | I-Connect007 Editorial Team
Nvidia has begun production of its next-generation Blackwell GPUs in the United States, but the company still depends heavily on Taiwan to complete the process, The Register reported.

TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand

10/27/2025 | I-Connect007 Editorial Team
TSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.

YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications

10/24/2025 | BUSINESS WIRE
Yield Engineering Systems (YES), a leading provider of advanced process equipment for AI and high-performance computing (HPC) semiconductor applications, announced that it has received multiple tool orders from a global leader in AI infrastructure solutions.

TSMC Reports Third Quarter EPS of NT$17.44

10/22/2025 | TSMC
TSMC announced consolidated revenue of NT$989.92 billion, net income of NT$452.30 billion, and diluted earnings per share of NT$17.44 (US$2.92 per ADR unit) for the third quarter ended September 30, 2025.
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