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Terran Orbital Completes Delivery of Satellite Bus Platforms to Lockheed Martin for the Tranche 1 Transport Layer
September 23, 2025 | BUSINESS WIREEstimated reading time: 1 minute
Terran Orbital Corporation, a leading manufacturer of small satellites primarily serving the aerospace and defense industries, today announced the successful delivery of all 42 satellite bus platforms for the Space Development Agency’s (SDA) Proliferated Warfighter Space Architecture Tranche 1 program. These spacecraft help form a resilient, low-latency communications network in low Earth orbit, designed to deliver secure data connectivity to warfighters across the globe.
“Completing delivery of all satellite buses for the SDA’s Tranche 1 Transport Layer marks a major achievement for Terran Orbital and a key milestone in our work with Lockheed Martin,” said Peter Krauss, President and Chief Executive Officer of Terran Orbital.
“Our team’s relentless dedication and technical excellence have been on full display throughout this program. With Lockheed Martin and the Space Development Agency, we are helping to develop a secure and resilient space communications architecture that will enhance national security and strengthen allied operations around the world.”
The inaugural launch of the Tranche 1 Transport and Tracking satellite constellations began Sept. 10 with the first 21 data transport satellites. Nine additional launches are expected to occur at a pace of approximately one per month, continuing until the entire constellation is fully deployed and operational in orbit in 2026.
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Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.