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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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PDN Optimization: Balancing Performance and Cost in SoC Designs
October 22, 2025 | Zach Caprai. Siemens EDAEstimated reading time: Less than a minute
The evolution of adaptive system-on-chip (SoC) devices has brought unprecedented computing capabilities to modern electronic systems. However, with this advancement comes increasingly complex power delivery challenges. In particular, as organizations strive to accelerate time-to-market while managing costs, optimizing power delivery networks (PDNs) has become a critical factor in successful product development.
This article demonstrates advanced PDN optimization techniques through a real-world case study of AMD’s Versal adaptive SoC platform. Using the VCK190 evaluation kit featuring the Versal AI Core series VC1902 device, I’ll explore how effective PDN design and optimization can help meet demanding technical specifications while addressing essential business goals.
Understanding Modern PDN Challenges
Modern SoCs require precise power delivery across a broad frequency spectrum, from DC to the gigahertz range. The PDN must maintain stable voltage levels while managing current transients and minimizing impedance across all frequencies. For configurable devices like the AMD Versal adaptive SoC, this challenge is particularly complex because power requirements vary significantly based on device configuration and application.
To read this entire article, which appeared in the October 2025 issue of Design007 Magazine, click here.
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04/16/2026 | Alpha and Omega Semiconductor LimitedAlpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
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Koh Young Highlighting its Smart AI Solutions at the SMTA Monterrey Expo and Tech Forum
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Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.