-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
High Density Packaging User Group Announces ASKPCB Membership
November 3, 2025 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
“ASKPCB and Sundell are thrilled to join the HDP User Group,” said Fred Hickman, VP of North America Sales. “As part of our continuous drive toward innovation and collaboration, HDP provides an ideal platform to work alongside global leaders in the Technology field. With our new smart-factory operations in Sundell (Thailand facility), we look forward to contributing to HDP initiatives that advance next-generation PCB design, materials and manufacturing processes – while strengthening partnerships across the electronics supply chain.”
I am pleased to welcome ASKPCB to HDP, joining the outstanding organization working on HDP User Group projects. Their expertise and understanding of complex PCB fabrication for high-performance applications will support many HDP projects. They will contribute significantly to our advanced reliability assessment projects," said Larry Marcanti, Executive Director of HDP User Group.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
High Density Packaging User Group Announces Dynamic Electronics Membership
10/14/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.
Real Time with… IPC APEX EXPO 2024: The HDP User Group's Role in the Electronics Industry
05/22/2024 | Real Time with...IPC APEX EXPOBev Christian, a project facilitator from the HDP User Group, outlines the consortium's focus on new materials and reliability in the electronics industry, and their collaboration on non-proprietary projects. Key areas of interest include corrosion, PFAS, and lead-free solders. Bev also highlights the value of collaboration and mentions partnerships with other consortia. The HDP User Group welcomes interested individuals to get involved via their website.
High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership
05/20/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member.
High Density Packaging User Group Announces Gold Circuit Electronics Membership
02/06/2024 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Gold Circuit Electronics (GCE) has become a member.