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High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
July 1, 2025 | High Density Packaging User GroupEstimated reading time: 1 minute
High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
“Lincstech has been supporting the electronics industry with high quality Printed Wiring Boards for over 60 years and are proud to be a mainstay in the industry. We are privileged to play a key role in industries from Semiconductor Test, ensuring the functionality of electronic devices, to life-saving medical devices and beyond in rapidly growing segments such as AI,” said Eijiro Ikegami, President and CEO at Lincstech America Inc. “Lincstech is excited to join HDP User Group, especially as we are now a part of the Global Brands Manufacture (GBM) organization which is a member of the Passive Systems Alliance (PSA) group consisting of businesses producing Passive Components, Printed Circuit Boards, Electronic Manufacturing Services and IC Packaging. We look forward to working with HDP User Group and contributing to the advancement of PCBs and the greater electronics industry.”
“I am pleased to welcome Lincstech to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in leading edge PCBs and 3D substrates for high-speed computing and data systems will contribute significantly to our emerging technology projects”, said Larry Marcanti, Executive Director of HDP User Group.
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