Ventec to Exhibit Latest Materials and Machinery for Cutting-edge PCB Production at productronica 2025

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Ventec International Group will present advanced materials at Productronica 2025 in Munich, ushering in the ‘Glass Free Revolution’ with the latest and pro-bond & thermal-bond bondply materials. Meeting the growing need for substrates to support very high multi-GHz signal speeds, these high-performance RCF and RCC ranges combine superior signal integrity with physical strength and adhesion for reliability as well as high thermal conductivity for heat management.

In stack ups for cutting-edge applications like AI data centers and 5G infrastructure, and chip testing applications traditional glass reinforcement introduces tiny variations in dielectric properties that can degrade signal integrity at elevated frequency. Ventec’s new glass free pro-bond thermal-bond formulas, with Dk from 2.8 to 3.05 and Df from 0.0007 to 0.0065, ensure stable characteristics in high-frequency designs and boards with ultra-fine features.

Visitors to Productronica can discover how IC substrates and interposers, HDI boards, motherboards, server backplanes, and cellular network power amplifiers can reach new levels of performance using these materials.

There is more to see, of course, including Ventec’s autolam portfolio for advanced automotive applications. autolam is a curated selection of products, chosen to help automotive electronic designers find the right materials for their markets and applications. It brings together appropriately qualified materials to focus the search for needed properties such as thermal management, high-temperature performance, corrosion and CAF resistance, and high-speed signal integrity are priorities.

Alongside autolam at Productronica, Ventec’s aerolam portfolio provides the same focused search opportunities for aerospace projects, where performance and reliability are mission critical. Backed by AS9100 accreditation at all materials handling sites worldwide, the aerolam catalog contains materials selected for properties including high-temperature performance, stability, reliability, and compliance with demands such as documentation.

Further highlights include Ventec’s tec-thermal thermally conductive laminate, pre preg & IMS material technology, comprising advanced and high-performance formulas for demanding applications such as power conversion, electrical drives, and lighting in automotive, industrial, and domestic environments. Another focus will be Ventec’s tec-speed / Signal Integrity range of low-loss materials including halogen-free formulas for applications such as telecom and network infrastructure, servers, backplanes, high-frequency and high-speed designs including automotive communications, and high-performance consumer products.

In addition, the latest ultra-low-loss tec-speed / RF materials including tec-speed 30.0 PTFE tec-speed 20.0 with Df as low as 0.0009 target high-speed digital, radar, and radio-frequency applications.

Also at the booth, the ThinFlex series of flexible copper-clad laminates will showcase the broad range of options available for highly optimised flex-rigid PCB stack-ups, including adhesive-less and halogen-free formulas. The booth will also feature precision drills from Jinzhou, now available through Ventec in Europe, Middle East, and Africa (EMEA), in sizes down to sub-mm diameter for drilling and slotting PCBs, package substrates, automotive boards, and HDI.

Ventec Giga Solutions - the one-stop shop for PCB manufacturing machinery, consumables, and materials - will display its new and high-performing Yeitek contact cleaning machine. The group is skilled in evaluating PCB manufacturers’ needs and appropriate equipment to best meet the requirements, and can arrange factory planning, equipment sourcing and supply, installation, and ongoing support.

Meet Ventec at Productronica 2025, booth 242, Hall B3, November 18-21.