ASMPT Secures Additional Orders for 15 Chip-to-Substrate TCB Tools Amid AI Demand

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ASMPT, the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced it had secured additional orders for 15 Chip-to-Substrate (C2S) Thermo-Compression Bonding (TCB) tools for cutting-edge AI computing chips from a major OSAT partner of a leading foundry, following an earlier order win.

ASMPT continued to win orders as the sole supplier and Process of Record (POR) for the C2S TCB applications, enabling the customer’s next generation bonding for larger compound dies. Driven by advancement in artificial intelligence and high-performance computing applications, ASMPT is well-positioned to capitalise on the industry growth underpinned by its technological leadership.

"Winning these repeat orders underscores our customers’ trust in ASMPT as the technology and production partner of choice,” said Robin Ng, Group CEO, ASMPT. “This confidence is built on ASMPT’s ability to deliver production-proven solutions. Furthermore, ASMPT’s unmatched TCB solutions, spanning chip-on-wafer, chip-on-substrate, and HBM applications cement ASMPT as the essential enabler of the industry’s ambitious advanced packaging roadmaps.”

Driven by recent developments and investments in the AI ecosystem, ASMPT anticipates that the TCB Total Addressable Market (TAM) will surpass US$1 billion by 2027. The Group is strategically positioned to capture an estimated 35% to 40% share of this expanded market.