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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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I-Connect007 Editor's Choice: Five Most-Read Articles for 2025
January 2, 2026 | Michelle Te, I-Connect007Estimated reading time: 3 minutes
Happy New Year! As we begin 2026, I would like to pause and reflect on our most-read articles from 2025. They give us insight into what you’re focused on, and what you’re trying to understand, prepare for, and improve. Each piece earned its place through relevance, depth, and sustained reader engagement.
The five articles span a range of topics—from technology and manufacturing trends to workforce issues, leadership, and the practical challenges facing the industry. But what really connects them is relevance: Each addressed questions you were actively engaging with throughout the year.
I-Connect007 monitors these trends and provides content that you can immediately apply to enhance your bottom line. So, here are the top five reads of 2025.
Building a Manufacturing Career at DIS
Published Jan. 28, 2025
Managing Editor Marcy LaRont keyed in on an important concern for today’s new generation seeking meaningful work. Ryan Moore and Emily Telesca are two millennials who share their unique perspectives on building a career in the manufacturing industry. With backgrounds ranging from computer science to military service, they highlighted the fulfilling nature of their roles and the sense of camaraderie within the company. It was our top read of 2025.
The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend
Published March 26, 2025
Throughout the year, Digital Marketing Manager Brittany Martin has been discussing how varying your marketing approach is what makes the difference in capturing the attention of potential customers. In our most-read column of the year, Brittany discussed the merits of long-form over short-form content, stating that if you want to move from “that company I see everywhere” to “that company I trust,” the key is producing longer content: articles, white papers, and books. These aren’t just marketing tools; they’re proof of expertise.
J.A.M.E.S. Explores the Future of Additive Manufactured Electronics
Published Feb. 28, 2025
Another unique interview topped our most-read articles for 2025. This time, Andreas Salomon, chief scientist at J.A.M.E.S, a joint venture of Nano Dimension and HENSOLD, discussed the evolving landscape of additively manufactured electronics, highlighting the integration of cutting-edge technologies, such as micro-dispensing and ink jetting. It was a personal look into a unique organization and well worth a read if you missed it the first time.
UHDI Fundamentals: UHDI Technology and Quality 5.0
Published Sept. 18, 2025
Anaya Vardya, CEO of ASC Sunstone, has been sharing the breadth and depth of ultra high density interconnect technology all year. In this article, Anaya demonstrated that the convergence of UHDI technology and Quality 5.0 represents a transformative leap in electronics design and manufacturing. UHDI enables extreme miniaturization and enhanced performance, while Quality 5.0 delivers adaptive, intelligent human-centric quality systems. Together, they set the foundation for advanced electronics that are smarter, more resilient, and more sustainable.
Connect the Dots: How to Avoid Five Common Causes of Board Failure
Published Sept. 2, 2025
“Boards fail for various reasons,” wrote Matt Stevenson, vice president and general manager of ASC Sunstone. “My experience is that most board failures are the result of common issues with design.” Matt has been writing and speaking about all aspects of board design and manufacturing through his columns and podcast series. He has an “ongoing crusade” to help designers design for the reality of manufacturing. Focusing on the five common causes of board failure caught the attention of many readers this year.
Honorable mention
IPC President’s Award: Cathy Hanlin
Published April 7, 2025
The IPC President’s Award is given to IPC members who have exhibited ongoing leadership in IPC and have made significant contributions of time and talent to the association and the electronic interconnect industry. Individuals can receive this award only once. Cathy Hanlin was loved and respected in the electronics manufacturing industry. She passed away in the fall of 2024, and her team at Precision Manufacturing accepted the award on her behalf. This article provides more detail about Cathy’s life and work.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the US Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.