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Indium Brings Precision Au-Based Die-Attach Preforms to SPIE Photonics West
January 9, 2026 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation® will showcase its high-reliability, Au-based precision die-attach preforms for critical laser applications at SPIE Photonics West, January 20-22, in San Francisco, California.
Indium Corporation will feature the following products:
- AuLTRA® DA0001 are precision AuSn die-attach preforms that adhere to the highest level of quality available to deliver the best performance possible in critical, high-reliability laser applications. Key features include:
- Highly accurate thickness control
- Precise edge quality
- Optimized cleanliness
- Standard waffle pack method
- Available for gold-based alloys
- AuLTRA® ThInFORMS® are 0.00035-inch-thick (0.00889mm, or 8.89μm) AuSn preforms that improve the overall operational efficiency of high-output lasers and help combat common issues such as shorting and poor thermal transfer.
- AuLTRA® Fine Ribbon is the company’s AuSn precision ribbon for high-volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance, as are their long, continuous lengths. These features help minimize production downtime and facilitate an efficient, high-throughput process resulting in a high-quality end product with low cost of ownership.
- Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems and offers a sustainable solution attributable to the company’s indium reclaim and recycle program.
- Liquid Metal TIMs are designed to provide superior thermal conductivity for both TIM0 and TIM1 applications. Liquid Metal TIMs offer high thermal conductivity to enhance end-product longevity and reliability, low interfacial resistance against most surfaces to dissipate heat quickly, and exceptional wetting ability to both metallic and nonmetallic surfaces. They are available in a variety of alloys, including InGa and InGaSn.
To learn more about Indium stop by show booth #4923.
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Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Indium to Present High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Indium Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
04/28/2026 | Indium CorporationIndium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.
Indium Corporation Joins India’s IDSPS Industry Consortium Partnership
04/24/2026 | Indium CorporationIndium Corporation announced that it has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative supporting R&D, workforce development, and global supply-chain growth.
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.