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Ignite Next Welcomes Synopsys to its Scale-up Program for Deep Tech Innovation
January 20, 2026 | PRNewswireEstimated reading time: 2 minutes
Ignite Next, the independent scale-up program for deep tech innovation, announced that Synopsys, the leader in engineering solutions from silicon to systems, has joined the program as a focus technology collaborator. This addition significantly strengthens the multi-partner setup launched earlier this month, which is designed to help European deep tech founders move faster from "Pre to B".
Synopsys joins Infineon and Intel in supporting the program's portfolio companies. Ignite Next is focused on turning early-stage deep tech ventures into globally competitive scale-ups. The program's independent structure facilitates closer, hands-on involvement between world-leading technology firms and startups, tackling Europe's deep tech growth gap.
The program focuses on IP-heavy breakthrough technologies, including semiconductors, physical AI, and advanced computing. Besides access to tools, infrastructure, and technology, Synopsys will contribute with its strategic industry expertise by providing technical and commercial mentorship to deep tech founders.
Antonio Varas, Chief Strategy Officer at Synopsys, said: "Breakthrough innovation in semiconductors, AI, and advanced computing is increasingly being shaped by agile, deep tech startups pushing the boundaries of what's possible. Their agility and vision are critical to solving complex challenges and unlocking transformative technologies. Through our involvement with Ignite Next, Synopsys empowers deep tech innovators with the tools, expertise and guidance needed to accelerate their journey from groundbreaking ideas to real-world impact."
Ignite Next operates a non-dilutive, founder-first model, ensuring startups can scale without sacrificing ownership. The high-touch program is guided by a network of more than 300 senior industry mentors.
The addition of Synopsys reinforces the collective impact model, strengthening the entire ecosystem in its competitiveness in deep tech. By gaining early access to disruptive innovations and emerging trends, Ignite Next technology partner companies can influence industry technologies and apply the insights in own developments, products and roadmaps.
Alois Eder, CTO and Co-founder of Ignite Next, commented: "We launched Ignite Next with the mission of providing deep, relevant expertise to Europe's most promising deep tech founders. Synopsys joining is a powerful validation of our independent, multi-partner setup. With their leadership in Electronic Design Automation (EDA), IP, and simulation and analysis from silicon to systems, we extend our network of experts with broader technology coverage, deeper market access, and finally stronger outcomes."
Alumni from the Ignite model include Black Semiconductor, Proxima Fusion, Corintis, Quantum Diamonds, Cerabyte, and Space Forge. These companies are proving Europe's outstanding capabilities in frontier technologies.
Dr. Daniel Schall, CEO of Black Semiconductor (Alumnus of Ignite), added: "For deep tech ventures, success hinges on bridging the science with industrial-scale execution. Ignite Next achieves this by providing not just capital readiness, but direct access to world-class technical tools and mentorship. Specifically, the technical depth offered by a leader like Synopsys is invaluable, transforming how quickly founders can scale complex, IP-heavy technologies like our own from the lab into market-ready products."
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Rachael Temple - AlltematedSuggested Items
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids
04/30/2026 | SiemensSwinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.