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Designing for Reliability: Why Understanding Materials, Cleanliness, and Lifecycle Matters More Than Ever
January 28, 2026 | Marcy LaRont, I-Connect007Estimated reading time: 1 minute
Before a product enters manufacturing—long before the first panel hits the assembly line—its reliability is determined by a series of fundamental design decisions. Designing a PCB is not simply a matter of placing components on a board and sending the files to manufacturing. Designing for reliability requires a holistic approach.
Every material, from solder mask and laminate to flux and solder alloy, interacts with processing chemistry, environmental contaminants, and thermal cycling throughout the product’s lifetime. The environment in which the product is expected to work, and its intended lifecycle demands, must be understood at the outset. Failing to consider the design from every aspect can turn a promising design into a very expensive cautionary case study.
Flex Ltd. (formerly Solectron/Flextronics International) is one of the largest EMS providers in electronics manufacturing today. At productronica, Tiberiu (Tibi) Baranyi of Flex presented a comprehensive presentation on design for reliability, providing real-world case examples that illustrated the unfortunate outcomes of decisions that caused failures, and which should have been made differently. I spoke with him about why this topic is so important for designers to understand from the outset.
Marcy LaRont: Tibi, if there is one word on everyone’s lips, other than AI, it’s reliability. With today’s technology demands, the challenges around guaranteeing reliability are significant.
Tiberiu Baranyi: Yes, this is a key point. Before a design rolls into manufacturing, before it even progresses from concept to the initial phases of the design process, there are questions that must be answered. Product application, operating environment, and its expected lifecycle are three primary pieces of information you must have to create a successful design. Many factors need to come together in the design. It's not just throwing components on a printed writing board. Understanding your product’s end operating environment also dictates the best processes to use in manufacturing. These are things that must be considered and communicated when creating the design.
To continue reading this interview, which originally appeared in the January 2026 I-Connect007 Magazine, click here.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
01/30/2026 | Marcy LaRont, I-Connect007It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.
Beyond IPC-2152: Creating Technology-specific Current-carrying Capacity Design Charts Using Thermal Modeling
01/29/2026 | Mike Jouppi, Thermal Management LLCDesigners commonly size traces using online calculators based on IPC-2221 or IPC-2152 charts, selecting width and thickness for a given current and allowable temperature rise (ΔT). Consideration is given to parallel conductors, although this is not a practical evaluation method for most designs. An important aspect of trace heating, especially groups of traces, is the power dissipated by the conductors. Unfortunately, the power dissipation or a method for accounting for power losses in the traces/conductors or planes is not straightforward.
Elementary Mr. Watson: Where the PCB Ends and Advanced Packaging Begins
01/29/2026 | John Watson -- Column: Elementary, Mr. WatsonChange sits at the center of almost everything in PCB design. From the earliest days of printed circuits to today’s highly integrated electronic systems, stability does not define this discipline; evolution does. Materials change, component geometries shrink, signal speeds increase, and manufacturing processes advance. With each shift, we reshape the role of the PCB designer, sometimes quietly, and other times in a way that feels like a freight train driving through your living room.
Thermonat Makes Nanoscale Thermal Prediction Practical for Chip Design
01/23/2026 | DARPAAs microelectronics push far below the 10-nanometer scale, heat has become one of the most significant barriers to next-generation chip performance.
Mouser Drives Electronic Design Excellence with Motor Control Resource Hub for Engineers
01/22/2026 | BUSINESS WIREMouser Electronics, Inc., is helping engineers stay ahead in motor control design with its online motor control resource center.