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Designing for Reliability: Why Understanding Materials, Cleanliness, and Lifecycle Matters More Than Ever
January 28, 2026 | Marcy LaRont, I-Connect007Estimated reading time: 1 minute
Before a product enters manufacturing—long before the first panel hits the assembly line—its reliability is determined by a series of fundamental design decisions. Designing a PCB is not simply a matter of placing components on a board and sending the files to manufacturing. Designing for reliability requires a holistic approach.
Every material, from solder mask and laminate to flux and solder alloy, interacts with processing chemistry, environmental contaminants, and thermal cycling throughout the product’s lifetime. The environment in which the product is expected to work, and its intended lifecycle demands, must be understood at the outset. Failing to consider the design from every aspect can turn a promising design into a very expensive cautionary case study.
Flex Ltd. (formerly Solectron/Flextronics International) is one of the largest EMS providers in electronics manufacturing today. At productronica, Tiberiu (Tibi) Baranyi of Flex presented a comprehensive presentation on design for reliability, providing real-world case examples that illustrated the unfortunate outcomes of decisions that caused failures, and which should have been made differently. I spoke with him about why this topic is so important for designers to understand from the outset.
Marcy LaRont: Tibi, if there is one word on everyone’s lips, other than AI, it’s reliability. With today’s technology demands, the challenges around guaranteeing reliability are significant.
Tiberiu Baranyi: Yes, this is a key point. Before a design rolls into manufacturing, before it even progresses from concept to the initial phases of the design process, there are questions that must be answered. Product application, operating environment, and its expected lifecycle are three primary pieces of information you must have to create a successful design. Many factors need to come together in the design. It's not just throwing components on a printed writing board. Understanding your product’s end operating environment also dictates the best processes to use in manufacturing. These are things that must be considered and communicated when creating the design.
To continue reading this interview, which originally appeared in the January 2026 I-Connect007 Magazine, click here.
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Brent Fischthal - Koh YoungSuggested Items
Teradyne Acquires TestInsight, Accelerating Time to Market for AI and Data Center Devices
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Cadence, Google Scale AI Chip Design with ChipStack on Google Cloud
04/16/2026 | Cadence Design SystemsCadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
April Issue of I-Connect007 Magazine: Beyond the Rulebook
04/14/2026 | I-Connect007 Editorial TeamIn this month’s I-Connect007 Magazine, we asked PCB designers, fabricators, and suppliers what it really means to operate without a rulebook. Their perspectives vary, especially between seasoned designers and experienced fabricators, but a common thread emerges: progress depends on pushing boundaries and finding a way forward, even when the path isn’t clear. In many ways, this mindset has always been part of what we do, whether we’ve called it that or not.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.