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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/30/2026 | Marcy LaRont, I-Connect007
It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.

Beyond IPC-2152: Creating Technology-specific Current-carrying Capacity Design Charts Using Thermal Modeling

01/29/2026 | Mike Jouppi, Thermal Management LLC
Designers commonly size traces using online calculators based on IPC-2221 or IPC-2152 charts, selecting width and thickness for a given current and allowable temperature rise (ΔT). Consideration is given to parallel conductors, although this is not a practical evaluation method for most designs. An important aspect of trace heating, especially groups of traces, is the power dissipated by the conductors. Unfortunately, the power dissipation or a method for accounting for power losses in the traces/conductors or planes is not straightforward.

Elementary Mr. Watson: Where the PCB Ends and Advanced Packaging Begins

01/29/2026 | John Watson -- Column: Elementary, Mr. Watson
Change sits at the center of almost everything in PCB design. From the earliest days of printed circuits to today’s highly integrated electronic systems, stability does not define this discipline; evolution does. Materials change, component geometries shrink, signal speeds increase, and manufacturing processes advance. With each shift, we reshape the role of the PCB designer, sometimes quietly, and other times in a way that feels like a freight train driving through your living room.

Thermonat Makes Nanoscale Thermal Prediction Practical for Chip Design

01/23/2026 | DARPA
As microelectronics push far below the 10-nanometer scale, heat has become one of the most significant barriers to next-generation chip performance.

Mouser Drives Electronic Design Excellence with Motor Control Resource Hub for Engineers

01/22/2026 | BUSINESS WIRE
Mouser Electronics, Inc., is helping engineers stay ahead in motor control design with its online motor control resource center.
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