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HBM4 Validation Expected in 2Q26; Three Major Suppliers Poised to Shape NVIDIA Supply Landscape
February 13, 2026 | TrendForceEstimated reading time: 1 minute
TrendForce’s latest analysis of the HBM industry reveals that as the ongoing expansion of AI infrastructure continues to fuel GPU demand, NVIDIA’s upcoming Rubin platform is expected to become a major catalyst for HBM4 adoption once mass production begins. The three leading memory suppliers—Samsung, SK hynix, and Micron—are now in the final stages of HBM4 validation, with completion anticipated by 2Q26.
Samsung, supported by its strong product stability, is projected to secure certification first. SK hynix and Micron are expected to follow shortly thereafter, forming a three-supplier ecosystem for NVIDIA’s HBM4.
TrendForce notes that the rapid expansion of inference AI use cases—particularly among North American CSPs racing to capture early AI agent opportunities—has significantly strengthened demand momentum since late 2025. NVIDIA remains cautiously optimistic about the commercial outlook for its next-generation Rubin platform as CSPs accelerate the deployment of AI servers, reinforcing positive expectations for HBM4 bit demand growth.
On the supply side, however, the broader memory shortage has intensified. Prices for conventional DRAM have surged sharply since 4Q25, narrowing HBM’s historical advantage in profitability. Memory vendors are therefore recalibrating capacity allocation between HBM and conventional DRAM to balance overall revenue growth and customer commitments. Under such conditions, NVIDIA’s reliance on a single supplier could hinder the ramp-up of the Rubin platform.
For suppliers, sustained growth in GPU demand—coupled with HBM’s complex design and validation uncertainties—requires memory makers to continuously advance product roadmaps across generations to avoid missing market opportunities. An optimistic outlook on HBM4 demand, the inability of any single supplier to fully satisfy Rubin requirements, and the strategic need for vendors to maintain multi-generation market share mean TrendForce expects NVIDIA to incorporate all three major suppliers into its HBM4 supply chain.
Samsung currently leads in terms of validation progress and is expected to begin phased mass production following completion in 2Q26. SK hynix continues to advance steadily and is likely to retain a competitive edge in bit allocation, supported by its longstanding HBM partnership with NVIDIA. Micron, while progressing at a relatively slower pace, is also expected to complete validation by 2Q26.
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HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
01/08/2026 | TrendForceTrendForce’s recent investigations indicate that Nvidia has revised the HBM4 specifications for its Rubin platform in 3Q25, raising the required per-pin speed to above 11 Gbps.
NVIDIA Seeks to Raise HBM4 Specs in Response to AMD Competition; SK hynix Expected to Remain Largest Supplier in 2026
09/18/2025 | TrendForceTrendForce reports that NVIDIA has recently pressed key component suppliers of its Vera Rubin server racks to upgrade product specifications, specifically requesting that HBM4 speed per pin be raised to 10 Gbps, as AMD gets set to launch its MI450 Helios platform in 2026.
Micron Ships HBM4 to Key Customers to Power Next-Gen AI Platforms
06/11/2025 | MicronThe importance of high-performance memory has never been greater, fueled by its crucial role in supporting the growing demands of AI training and inference workloads in data centers. Micron Technology, Inc., announced the shipment of HBM4 36GB 12-high samples to multiple key customers.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
05/22/2025 | TrendForceTrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.
Cadence Enables Next-Gen AI and HPC Systems with Industry’s Fastest HBM4 12.8Gbps IP Memory System Solution
04/21/2025 | Cadence Design SystemsCadence announced the industry’s fastest HBM4 12.8Gbps memory IP solution, which meets the increasingly higher memory bandwidth needs of SoCs targeted for the next generation of AI training and HPC hardware systems.