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DesignCon 2026: From Copper to Quantum to Agentic AI

02/26/2026 | Kelly Dack, I-Connect007
Greetings from “balmy” Santa Clara, where DesignCon 2026 is officially underway. The conference began in 1995 as Design SuperCon, and now in its 31st year, remains Silicon Valley’s annual summit for signal and power integrity pros. As I walked into the hotel next to the Santa Clara Convention Center, I could sense echoes of the thousands of football fans who packed the area just weeks ago for the Super Bowl. For me, though, DesignCon is the big game, where our industry’s MVPs take the field to show how fast the technology playbook is evolving.

DesignCon Taps NASA, Purdue, and Agentrys for Keynote Slate

02/24/2026 | GlobeNewswire
DesignCon, the premiere event for the latest in high-speed design tools, technologies, and developments, has announced the keynote speakers for the 2026 edition.

Zhen Ding’s Chairman Charles Shen Shares 10 Life Lessons with Graduates

05/27/2025 | Zhen Ding
At the 2025 Commencement Ceremony, Yuan Ze University sincerely invites a renowned yet low-profile figure in the PCB industry, Chairman Charles Shen of Zhen Ding Technology Group, as the keynote speaker.

SMTA Symposium on Counterfeit Parts & Materials Program Finalized

05/21/2025 | SMTA
The SMTA is pleased to announce the technical program for the Symposium on Counterfeit Parts & Materials. Co-organized by SMTA and the Center for Advanced Life Cycle Engineering (CALCE), the event will be held June 24-26, 2025 in Hyattsville, Maryland at the College Park Marriott Conference Center.

Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging

04/30/2025 | Real Time with...IPC APEX EXPO
In a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
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