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Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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Big Ideas Take the Stage: APEX EXPO 2026 Keynotes
February 25, 2026 | Michelle Te, I-Connect007Estimated reading time: 2 minutes
Some of the most consequential conversations in electronics manufacturing will take center stage at APEX EXPO 2026, with a keynote lineup that spans quantum computing, advanced packaging, artificial intelligence, and the global electronics economy.
From IBM and Intel technologists to an AI futurist and a global industry leader, this year’s keynote speakers will offer attendees both technical depth and strategic perspective on the forces reshaping the electronics ecosystem.
Quantum Computing Takes Center Stage
Dr. David Lokken-Toyli
When: Monday, March 16 | 1:30–2:30 p.m.
Session: “Computing at the Quantum Advantage Frontier” (Conference Keynote; registration required)
David Lokken-Toyli, a principal research scientist at IBM Quantum, opens the conference speaking on one of the hottest topics in technology: the trajectory from today’s quantum prototypes toward large-scale, error-corrected quantum systems. His keynote will frame IBM’s hardware roadmap and highlight why quantum computing matters to the broader electronics ecosystem, especially how hardware advances create new opportunities for component and subsystem suppliers. Attendees can expect insights on emerging quantum workflows and where electronic manufacturing fits into future quantum supply chains.
Packaging Innovation and Integration
Dr. Ravi Mahajan
When: Monday, March 16 | 2:30–3:30 p.m.
Session: “Advanced Packaging: A Crucial Enabler for Heterogeneous Integration” (Conference Keynote; registration required)
Following the quantum keynote, Dr. Ravi Mahajan, Intel Fellow and director of Assembly & Packaging Technology Pathfinding, will tackle advanced packaging, the linchpin technology for heterogeneous integration (HI). It is foundational to performance scaling across chips, modules and systems. Mahajan will outline key research and industry-academic collaborative roadmap efforts, explaining what advanced packaging means in practice and why it’s a catalyst for next-generation electronics. He’ll also explain real-world opportunities and challenges around interconnect scaling, which are essential knowledge for engineers and technology strategists alike.
AI’s Renaissance and Business Disruption
Zack Kass
When: Tuesday, March 17 | 8:30–9:30 a.m.
Session: “The Next Renaissance” (Opening Keynote; open to all attendees)
Zack Kass is a futurist, AI thought leader, and former head of Go-To-Market at OpenAI. In his keynote, Kass draws sharp parallels between the transformative impact of artificial intelligence today and the cultural rebirth of the historical Renaissance. Instead of dwelling on hype or fear, he’ll focus on practical, positive applications of AI, breaking down complex tech for business leaders and outlining strategies organizations can use to stay ahead of rapid AI evolution. Expect insights on workforce impact, enterprise transformation and how to turn disruption into opportunity.
Electronics Powering the Future
Dr. John W. Mitchell
When: Wednesday, March 18 | 12:00–1:30 p.m.
Session: “The Electronics Revolution: Powering Every Industry’s Future” (Luncheon Keynote; registration required)
Dr. John W. Mitchell, president and CEO of the Global Electronics Association, brings a midweek data-rich, strategic keynote, addressing electronics as a $6 trillion foundational industry, touching everything from AI and autonomous systems to aerospace, healthcare and smart infrastructure. Mitchell will discuss geopolitical pressures, supply chain challenges, and the need for strategic interdependence across regions and sectors. His goal is to equip industry professionals with building resilience and unlocking growth in an increasingly interconnected global market.
Why These Keynotes Matter
This lineup reflects APEX EXPO’s broad industry scope in emerging technology, core manufacturing evolution, transformational forces, and big-picture industry strategy.
For attendees, these keynotes deliver thought leadership with practical takeaways, from technical roadmaps to business strategy, that can help shape next-year planning and competitive positioning.
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DesignCon 2026: From Copper to Quantum to Agentic AI
02/26/2026 | Kelly Dack, I-Connect007Greetings from “balmy” Santa Clara, where DesignCon 2026 is officially underway. The conference began in 1995 as Design SuperCon, and now in its 31st year, remains Silicon Valley’s annual summit for signal and power integrity pros. As I walked into the hotel next to the Santa Clara Convention Center, I could sense echoes of the thousands of football fans who packed the area just weeks ago for the Super Bowl. For me, though, DesignCon is the big game, where our industry’s MVPs take the field to show how fast the technology playbook is evolving.
DesignCon Taps NASA, Purdue, and Agentrys for Keynote Slate
02/24/2026 | GlobeNewswireDesignCon, the premiere event for the latest in high-speed design tools, technologies, and developments, has announced the keynote speakers for the 2026 edition.
Zhen Ding’s Chairman Charles Shen Shares 10 Life Lessons with Graduates
05/27/2025 | Zhen DingAt the 2025 Commencement Ceremony, Yuan Ze University sincerely invites a renowned yet low-profile figure in the PCB industry, Chairman Charles Shen of Zhen Ding Technology Group, as the keynote speaker.
SMTA Symposium on Counterfeit Parts & Materials Program Finalized
05/21/2025 | SMTAThe SMTA is pleased to announce the technical program for the Symposium on Counterfeit Parts & Materials. Co-organized by SMTA and the Center for Advanced Life Cycle Engineering (CALCE), the event will be held June 24-26, 2025 in Hyattsville, Maryland at the College Park Marriott Conference Center.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.