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Intervala Invests $6M+ to Expand High-Reliability Electronics Manufacturing Capabilities
February 26, 2026 | BUSINESS WIREEstimated reading time: 2 minutes
Intervala, a full-service electronics manufacturing services (EMS) provider specializing in complex electronic and electromechanical products, has invested more than $6 million in advanced manufacturing technology, automation, and facility expansion to strengthen its high-reliability capabilities for OEMs operating in mission-critical industries, including data center infrastructure and defense. The expansion strengthens Intervala’s printed circuit board assembly (PCBA) and electromechanical operations to support rising demands driven by AI workloads, defense modernization, and advanced medical technologies.
The company’s recent upgrades include industry-leading equipment selected to improve quality, consistency, and throughput. This includes:
- Panasonic SMT pick-and-place systems across five production lines for high-accuracy assembly
- Panasonic screen printing systems to ensure precise solder paste deposition and repeatable process control
- Koh Young automated optical inspection (AOI) systems for real-time defect detection and process feedback
- Takaya Flying Probe Testing for flexible electrical test coverage; and
- Fanuc six-axis cobots to support automation and repeatability.
“Across the markets we serve, products are becoming more complex and expectations continue to rise,” said Rob McKernan, CEO of Intervala. “Manufacturing readiness is now just as critical as design innovation. Our continued commitment to advanced technology, backed by our deeply experienced engineering team, ensures we can deliver the precision, reliability, and repeatability these complex systems demand.”
Intervala Expands Manufacturing Capacity to Address Growing Demand in Defense and AI Infrastructure
As part of the initiative, Intervala completed a 60,000-square-foot facility build-out, transforming previously underutilized space into fully operational manufacturing capacity. In addition, the installation of automated storage and retrieval systems (AS/RS) freed up approximately 40,000 square feet of additional floor space. Together, these improvements bring Intervala’s total footprint to approximately 200,000 square feet.
Intervala’s enhanced manufacturing environment is purpose-built to support today’s most demanding electronics designs and fully integrated electromechanical systems, including fine-pitch and high-density component placement, highly complex assemblies, rigorous inspection, testing, and traceability, as well as low- to mid-volume production with stringent reliability requirements. These capabilities are increasingly critical as OEMs seek to deliver greater functionality in smaller, denser board footprints without compromising performance or compliance.
In mission-critical infrastructure markets, customer partners are seeing the impact of Intervala’s approach firsthand. “Our customers are navigating unprecedented complexity - from AI-driven data center expansion to next-generation defense and medical systems,” said McKernan. “They need a manufacturing partner that can scale with confidence, execute with precision, and engineer for reliability from day one. This investment ensures we’re not just keeping pace with demand - we’re helping our customers gain a competitive edge with systems built to perform when it matters most.”
Collectively, these enhancements strengthen Intervala’s ability to deliver complex, high-reliability programs at scale. The company combines the advanced technology, scale, and cost advantages typically associated with large contract manufacturers with the flexibility, responsiveness, and partnership more often found in smaller providers, enabling OEMs to move forward with confidence as product complexity increases.
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AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System
04/15/2026 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.
HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots
04/15/2026 | PRNewswireHYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology
04/14/2026 | PRNewswireCarbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.