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Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads.
As semiconductor devices continue to shrink and increase in complexity, diverse CMP processes are critical to achieving the precision required for reliable device performance. Optivision™ Max CMP pads are designed to help manufacturers maintain tighter control across these increasingly demanding process steps.
“Advanced nodes and evolving device architectures are driving new levels of complexity across semiconductor manufacturing,” said Sanjay Kotha, VP and General Manager of CMP Technologies at Qnity. “Optivision™ Max pads reflect our continued focus on advancing CMP solutions to help customers meet the increasing performance and quality demands of next-generation technologies.”
Building on the Optivision™ CMP pad family, Optivision™ Max offers improved defect control and extended pad lifetime, supporting higher yield and overall process efficiency. Optivision™ Max is Qnity’s newest commercial soft polishing pad, delivering superior performance in critical CMP steps to enhance surface quality, process stability, and reliability for advanced architectures and nodes.
The Optivision™ Max CMP pad family is compatible with a range of CMP applications and can be tailored to meet specific customer requirements. The first commercial offering, Optivision™ Max 8300, is available in all regions for customer sampling and orders in a range of configurations, including integrated windows for endpoint detection.
