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Follow the Story: Building the Hardware Behind AI

09/24/2026 | Michelle Te, I-Connect007
When TTM opened its new UHDI facility in New York earlier this year, it wasn't simply adding another PCB factory. As the largest circuit board builder in the United States, TTM was investing in technologies that bring PCB fabrication closer to the complex world of semiconductor packaging. The advent of AI helps explain why that matters. The enormous compute power required by AI is pushing chip performance to new levels, but those chips don't operate in isolation.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/18/2026 | Nolan Johnson, I-Connect007
The middle months of 2026 have been defined by, shall we say, “projects” throughout the industry, and as we approach the end of the third quarter, many of those projects are coming to light. That’s the theme I’m getting from this week’s news, and I tried to capture it with my selections. My must-reads include a market update on the leading fabless semiconductor houses, a call to action from SEMI directed at the policymakers in the European Union, a rollup of workforce and educational programs announced just this week, a role change at Indium, and the relaunch of the Global Electronics Association Sustainability teams’ DMA Toolkit.  

CoWoS-L to Remain Mainstream AI Chip Packaging Solution Through 2028

09/18/2026 | TrendForce
TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging.

TTM Building the Infrastructure Around the Chip

09/17/2026 | Nolan Johnson, I-Connect007
TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.

SEMI Calls for Chips Act 2.0 to Boost Semiconductor Competitiveness

09/14/2026 | SEMI
SEMI renews its call on European policymakers to use the proposed Chips Act 2.0 to strengthen Europe’s semiconductor competitiveness, reinforce supply chain resilience, and create the conditions needed to attract and sustain investment across the entire semiconductor value chain.
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