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Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
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The Shaughnessy Report: UltraCAD Design's Doug Brooks
Doug Brooks, a high-speed design instructor and president of UltraCAD Design, talks signal integrity and packaging. He'll be speaking at IPC's Seminar of Future Advanced Packaging Technology in Santa Clara on June 2. Click here to listen.
More Columns from The Shaughnessy Report
The Shaughnessy Report: Breaking Down the Language BarrierThe Shaughnessy Report: Back to the Future
The Shaughnessy Report: The Designer of Tomorrow
The Shaughnessy Report: A Stack of Advanced Packaging Info
The Shaughnessy Report: A Handy Look at Rules of Thumb
The Shaughnessy Report: Are You Partial to Partial HDI?
The Shaughnessy Report: Silicon to Systems—The Walls Are Coming Down
The Shaughnessy Report: Watch Out for Cost Adders