-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Estimated reading time: 1 minute
Contact Columnist Form
IPC Forms a PAC
Archived column by Ray Rasmussen
IPC just announced they’re forming a political action committee. Here’s their reasoning for creating a PAC:
Political action committees (PACs) have become an important tool for any group that wants to be heard when laws and regulations are written. Given the growing number of government regulations that influence the electronics supply chain, having clout in Washington, D.C. is something that can no longer be ignored. As a result, IPC’s Board of Directors has decided to join the many trade associations and large companies that have established PACs.
I have reservations about IPC’s new direction in D.C. There’s some history.
In the early ‘90s, I was a huge supporter of prodding the industry to be more active in local and national government. Rules and regulations were constantly being developed without any input from our industries. The onslaught of environmental regulations coming from the EPA, the state regulators, and local municipalities left the industry frustrated and seemingly powerless. Something had to be done and the logical approach was for our national association, IPC, to take the lead. They had the industry clout to present the issues to the regulators or those in the Congress who would listen. They could tell the story and make the case for or against specific requirements.
When approached, IPC’s position was that they were a standards organization, and that lobbying and politics wasn’t their game. That stance changed as pressure mounted and newer, more open-minded board members began to see the importance of telling our story and having a seat at the table when new requirements on our industries were being proposed. Most in Congress, we found out, had no idea who we were or what we did. They didn’t know the role we played in everything electronic. They only knew of the big guys. And in their minds, anything to do with the electronics industry was “big business.”
Read the full column here.
Editor's Note: This column originally appeared in the February 2014 issue of SMT Magazine.
More Columns from Various Archived Columns
Slash Sheet Chaos: Is What You See, What You Get?Moisture in Materials: Avoiding Process Gremlins
Material Witness: Beat the Heat--A Non-Math Intro to Thermal Properties
Material Witness: Considerations in Using TC Materials for PWBs
Material Witness: Are Your Materials Up to the Challenge?
Material Witness: Thermal Oxidation of Materials, Part I
Material Witness: Thermal Oxidation of Materials, Part II
Material Witness: R.I.P. Speedboard C