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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Estimated reading time: Less than a minute

The Bare (Board) Truth: Basic Impedance Fab Guidelines, Part 1
When we talk about signal integrity or impedance lines, there are some very basic guidelines to follow. Remember, impedance mismatches cause signal reflections, which reduce voltage and timing margins.
Click here to listen. Or, for the written version of this column, click here.
More Columns from The Bare (Board) Truth
The Bare (Board) Truth: My Top Six Design ChallengesThe Bare (Board) Truth: Via Basics
The Bare (Board) Truth: 5 Questions About Improving Thermal Management
The Bare (Board) Truth: Teaching the Next Generation—An Overview of Today’s University Courses
The Bare (Board) Truth: Fabrication Starts With Solid Design Practices
Board Negotiations: Design Rules and Tolerances
The Bare (Board) Truth: Eliminate Confusion
The Bare (Board) Truth: Getting on the Same Page—A Data Story