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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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The Shaughnessy Report: Good Season For Trade Shows
It's spring and that means show season is in full swing. We've covered a half-dozen PCB trade shows since January, and all of them have shown increased attendance over last year. Despite a tumultuous 2009 and virtual challengers on the Web, the venerable trade show will probably be around for some time.
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More Columns from The Shaughnessy Report
The Shaughnessy Report: A Stack of Advanced Packaging InfoThe Shaughnessy Report: A Handy Look at Rules of Thumb
The Shaughnessy Report: Are You Partial to Partial HDI?
The Shaughnessy Report: Silicon to Systems—The Walls Are Coming Down
The Shaughnessy Report: Watch Out for Cost Adders
The Shaughnessy Report: Mechatronics—Designers Need to Know It All
The Shaughnessy Report: All Together Now—The Value of Collaboration
The Shaughnessy Report: Unlock Your High-speed Material Constraints