-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Estimated reading time: Less than a minute

Contact Columnist Form
Karl's Tech Talk: Laser Process Applications in Electronics
Figure 1 shows several laser imaging techniques, some are commercial, some are developmental. The best-known process is laser direct imaging (LDI), whereby photoresist or soldermask is exposed pixel-by-pixel without the use of a phototool.
Laser ablation processes are highlighted in green. Laser ablation approaches differ by laser source and in the type of material being ablated. Ablation of dielectric, or metal, or resist (metal etch resist such as immersion tin, organic non-imageable resist, or selected areas of exposed photoresist) are examples of ablation techniques that differ in the material being ablated.
Figure 1: Overview of laser structuring techniques.
This column originally appeared in the March 2013 issue of The PCB Magazine.
More Columns from Karl's Tech Talk
Karl's Tech Talk: Digital Imaging UpdateKarl’s Tech Talk: Electronic Packaging Levels
Green Legislation and the Impact on Electronic Materials and Processes
Digital Imaging Revisited
Dry Film Photoresist Thickness Selection Criteria
Quick-Turn Circuit Board Shops
Optical Interconnects
Signal Loss