-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
April 29, 2015 | Ben Gumpert, Lockheed MartinEstimated reading time: 13 minutes
These two components were selected based on results of previous testing. The QFN68 package has a very high die to body size ratio, and has performed relatively poorly in other thermal cycle tests. The QFN44 package, however, has a low die to body size ratio, and in a previous test, there were no failures after 2520 thermal cycles. This testing will investigate the ability to improve results on a ‘poorly’ performing part, as well as the potential for reducing performance on a ‘robust’ part.
To develop an idea about how the chosen experimental parameters and variation would affect test results, a simulation software package was used to predict the outcomes of the testing. Figure 2 shows the results of that simulation and the prediction of the average thermal cycle survival period for the QFN68 package at the solder joint heights to be used in this test. Results of previous testing were used as a baseline to fit the prediction results to the test vehicle used.
A 5 mil stencil was used for solder paste application with apertures similar to those shown in Figure 3, but which varied by location on the board to control the volume of solder deposited at different sites across the assembly. The volume of solder was controlled by the number and size of apertures on the center pad of the QFN/BTC footprint. The volume of solder applied to the perimeter pins was also adjusted, with the objective of creating similar solder joints on all component locations (i.e. solder joint with the same amount of toe wetting and with similar fillet shape), although the height of these joints was different from location to location. Ten different aperture patterns were used for the QFN44 package, and 14 different aperture patterns were used for the QFN68 package. Reduction of solder on the center pad ranged from 10% to 90%. These values are outside of both the minimum and maximum recommendations, but are being evaluated to observe potential trends.
Page 2 of 4
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.