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Current IssueBreaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
Level Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
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In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
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EIPC Summer Conference Just Around the Corner
June 9, 2015 | EIPCEstimated reading time: Less than a minute
It's less than two weeks away before the European Institute of Printed Circuits (EIPC) Summer Conference. To be held in Berlin from June 18 to 19, this year's event will include a guided tour of the Fraunhofer Institute.
The conference will have an iconic selection of speakers, including Alun Morgan, EIPC Chairman, who will present a market outlook on behalf of Walt Custer who is unable to join this year, as well as luminaries as Dr. Ivan Ndip, Lars Böttcher and Dr. Olaf Wittler, all from Fraunhofer IZM. Walter Huck of IEC and Martyn Gaudion of Polar Instruments will also be present, so as speakers from AT&S, Thales, Cimulec, Atotech, Taiyo, Camtek, First EIE, Du Pont and Cambridge Nanotherm, to name a few.
Download the conference registration form by clicking here.
For the detailed conference programme, click here.
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