Nolan’s Notes: Everyone Has Their Eye on India
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The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Reliability Study of Bottom Terminated Components (Part 1)
July 6, 2015 | J. Nguyen, H. Marin, D. Geiger, A. Mohammed, and M. Kurwa, Flextronics InternationalEstimated reading time: 6 minutes
Figure 5: LGA Images_ Non-identical Pad Size for Signal and Ground Pins.
Table 1: Component Details
Thermal Cycle Test Conditions
The thermal cycle testing was performed in an air-to-air thermal cycle chamber, from 0 to 100°C with 10-minute dwell time at each peak temperature, and a temperature ramp rate and cooling rate of approximately 10-15°C per minute. The chamber profile of temperature versus elapsed time is shown in Figure 6.
Figure 6: Thermal Cycle Temperature Profile - 0 to 100°C
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