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Freedom CAD offers Power Integrity Analysis
July 13, 2015 | Freedom CADEstimated reading time: 1 minute
As supply voltages continue to decrease and power consumption increases, impedance of power delivery networks at DC and over frequency has become a critical consideration for any electronic package or PCB design.
Using simulation to identify potential power integrity problems such as DC voltage drop and frequency response is essential for today’s high-speed digital designs. By using Ansys’ SIwave software, Freedom CAD Services has the ability to perform pre-layout power integrity analysis and reduce post–layout power delivery problems. This includes optimization of copper weights, bulk storage and bypass capacitor selection.
“We are pleased to be able to offer PCB engineering and layout solutions to our customers that can include Power Integrity and Voltage Drop analysis.” says Don Duncan, Chief Technology Officer at Freedom CAD Services. “It’s becoming increasingly important to understand and predict the potential impact of power integrity and voltage drop in the sensitive electronic products that we frequently design. I only see this importance growing as the design complexities grow across our projects from wearable devices to terabyte computers.”
About Freedom CAD
Freedom CAD Services is a multi-disciplined engineering company specializing in design services for complex high-speed and large electronic systems for the computer, telecom, mil-aero, medical, storage, industrial, automotive and consumer electronics markets. Established in 2003, Freedom CAD’s engineering and PCB design team of more than 40 designers have over 1000 years of combined experience using the industry's leading PCB CAD tools to bring extraordinary solutions. For more information, visit www.freedomcad.com.
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08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.