-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Henkel Forms Partnership with LPMS USA
September 22, 2015 | HenkelEstimated reading time: 2 minutes
In a move designed to offer customers greater access to low pressure molding solutions and its award-winning TECHNOMELT materials, Henkel Adhesive Technologies has formed a partnership with leading molding equipment manufacturer, LPMS USA.
“Henkel’s new relationship with LPMS USA is a very important development for our Americas-based customers,” explains Art Ackerman, Henkel Global Product Manager for Circuit Board Protection. “The company’s global leadership, in-depth understanding of mold design, broad equipment portfolio and low pressure molding expertise make LPMS USA a very competent partner.”
The low pressure molding process is a fast and effective alternative to traditional potting techniques. Leveraging the advanced capabilities of Henkel’s TECHNOMELT polyamide hotmelt products, LPMS USA systems process the materials in a simple operation that melts, molds and cools the TECHNOMELT materials around electronic devices to encapsulate them and form self-enclosed, functional assemblies. Because the low pressure molding process is lower stress compared to traditional injection molding, it is ideal for today’s finer-pitched, delicate devices and has been successfully employed in multiple applications including automotive, LED lighting, medical, wearables and household consumer products, among others.
LPMS USA offers a comprehensive portfolio of molding systems – ranging from handheld, tabletop units through to advanced, in-line automated platforms. The company’s expertise in mold design and thorough understanding of end-use requirements are key enablers for outstanding results. In addition, LPMS USA’s unique ‘melt on demand’ technology optimizes material use and energy consumption. Instead of keeping material molten for an entire shift, LPMS USA’s ‘melt on demand’ feature reduces heat residence of the TECHNOMELT material and only melts it when required. This is extremely beneficial for some of the newer white and optically clear TECHNOMELT formulations, and also reduces system cleaning time and downtime.
“Henkel is the premier materials supplier for low pressure molding materials,” says Kevin
Ross, VP of Sales and Marketing for LPMS USA. “The TECHNOMELT portfolio has won numerous awards and continues to expand to address emerging market requirements and new applications for low pressure molding processes. We are delighted to partner with Henkel and make the TECHNOMELT-LPMS USA solution available to customers across the Americas.”
For more information, visit www.henkel.com/electronics. Visitors to the upcoming SMTA International event, taking place over September 29 and 30 in Rosemont, IL, are invited to see TECHNOMELT and LPMS USA’s LPMS 500 in action during live demonstrations in Henkel booth #701.
About Henkel
Henkel operates worldwide with leading brands and technologies in three business areas:
Laundry & Home Care, Beauty Care and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel employs about 50,000 people and reported sales of $21.8 billion and adjusted operating profit of $3.4 billion in fiscal 2014. Henkel’s preferred shares are listed in the German stock index DAX.
Suggested Items
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.