Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
Herbstman, Holden and Kowalewski to Lead Denmark HDI Workshop
September 23, 2015 | Andy Shaughnessy, PCBDesign007Estimated reading time: 1 minute
This HDI workshop takes place Oct. 27-28 in Copenhagen, and it’s not only highly informative and educational, but it’s hands-on. First, attendees will be given an introduction to the principles of HDI and introduced to Mentor Xpedition, which is the platform used in this workshop.
This is NOT a Mentor Graphics tool training class—the principles can be used on all PCB design platforms. Therefore, you do not have to know Xpedition to attend this workshop.
Once you know the principles and the system, the fun begins! The rest of the time, attendees will be able to experience HDI capabilities first-hand by working at a workstation to practice connecting three advanced BGAs using HDI/microvias and then routing these HDI breakouts.
Target Audience
This workshop is for all PCB layout designers who see the need to achieve 2X to 4X higher board density, better electrical performance, or even those who just need to reduce the size or thickness of a finished board.
This class is essential for those who use HDI, but it is not limited to HDI designers. So, if you want to learn how to use HDI or just be better at it, come join us and learn from the best.
This is also a great networking opportunity; designers will be able to participate in a free networking dinner on the October 27 at the Hilton Copenhagen Airport Hotel. Here, you will be able to talk to the other participants, as well as instructor Steve Herbstman and assistants Happy Holden and Andy Kowalewski.
Focus is on the 6 Advanced Concepts In HDI Design:
1. Where to place the microvias
2. Creating boulevards with BGA breakouts
3. Elimination of through-hole with the stackup
4. Horz-vert microvia routing pairs
5. Automation of hand routing
6. Finer traces/spaces & via/pads
What you will learn:
1. Stackup and its critical role
2. Grounding scheme
3. Determining package types, pin counts, BGA pin spacing, etc.
4. Determining routing rules, line widths, grid patterns, etc.
5. Pin escaping and establishing routing channels and boulevards
6. Routing with constraint editor and via placement
The fee for this class is €1,600 excluding VAT. This includes the course book, labs, and the networking dinner on Oct. 27.
To register, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.