Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
Target Condition: Designing vs. Inventing
Dana on Data: The Missing AI-NPI Link
Herbstman, Holden and Kowalewski to Lead Denmark HDI Workshop
September 23, 2015 | Andy Shaughnessy, PCBDesign007Estimated reading time: 1 minute
This HDI workshop takes place Oct. 27-28 in Copenhagen, and it’s not only highly informative and educational, but it’s hands-on. First, attendees will be given an introduction to the principles of HDI and introduced to Mentor Xpedition, which is the platform used in this workshop.
This is NOT a Mentor Graphics tool training class—the principles can be used on all PCB design platforms. Therefore, you do not have to know Xpedition to attend this workshop.
Once you know the principles and the system, the fun begins! The rest of the time, attendees will be able to experience HDI capabilities first-hand by working at a workstation to practice connecting three advanced BGAs using HDI/microvias and then routing these HDI breakouts.
Target Audience
This workshop is for all PCB layout designers who see the need to achieve 2X to 4X higher board density, better electrical performance, or even those who just need to reduce the size or thickness of a finished board.
This class is essential for those who use HDI, but it is not limited to HDI designers. So, if you want to learn how to use HDI or just be better at it, come join us and learn from the best.
This is also a great networking opportunity; designers will be able to participate in a free networking dinner on the October 27 at the Hilton Copenhagen Airport Hotel. Here, you will be able to talk to the other participants, as well as instructor Steve Herbstman and assistants Happy Holden and Andy Kowalewski.
Focus is on the 6 Advanced Concepts In HDI Design:
1. Where to place the microvias
2. Creating boulevards with BGA breakouts
3. Elimination of through-hole with the stackup
4. Horz-vert microvia routing pairs
5. Automation of hand routing
6. Finer traces/spaces & via/pads
What you will learn:
1. Stackup and its critical role
2. Grounding scheme
3. Determining package types, pin counts, BGA pin spacing, etc.
4. Determining routing rules, line widths, grid patterns, etc.
5. Pin escaping and establishing routing channels and boulevards
6. Routing with constraint editor and via placement
The fee for this class is €1,600 excluding VAT. This includes the course book, labs, and the networking dinner on Oct. 27.
To register, click here.
Share on:
Suggested Items
Electronic Design Automation Market to Reach $17.47 Billion by 2030, Growing at a CAGR of 10.7%
03/31/2025 | PRNewswireThe growth of the EDA market is driven by the increasing complexity of integrated circuit (IC) designs, rising adoption of connected devices, and growing demand for EDA solutions in the aerospace and defense sectors. Additionally, the increasing integration of AI and machine learning in chip design is further boosting market expansion.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/28/2025 | Andy Shaughnessy, I-Connect007I’ve spent my week recovering from a busy and interesting week in Anaheim for the 25th IPC APEX EXPO. I think back to my first APEX EXPO, and the changes since then are too numerous to count. I first attended in 2004, also in Anaheim, back when there was almost no design content in the conference or expo portions of the show. It was just a few years after the downturn, and attendees and exhibitors alike were skittish, almost afraid to show confidence in our industry. A few unemployed design friends handed out copies of their resumes. Travel budgets were still down, and the aisles weren’t exactly packed with traffic.
It’s Only Common Sense: 7 Tips to Focus on What Works
03/31/2025 | Dan Beaulieu -- Column: It's Only Common SenseIn business, there’s always the temptation to be all things to all people, whether it’s expanding product lines, chasing every lead, or trying to keep up with competitors. The fear of missing out can lead to spreading our time, resources, and energy too thin. However, success doesn’t come from doing everything; it comes from doing the right things well.
HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology
03/27/2025 | PRNewswireThe consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.
GlobalFoundries Certifies Ansys Lumerical Photonic Design Tools for GF Fotonix™ Platform
03/27/2025 | PRNewswireAnsys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform.