Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
Target Condition: Designing vs. Inventing
Dana on Data: The Missing AI-NPI Link
2015 Phil Kaufman Award Honoring Mentor Graphics' Dr. Walden Rhines
October 28, 2015 | MarketwiredEstimated reading time: 2 minutes
WHAT:Dr. Walden Rhines, chairman and CEO of Mentor Graphics, will be honored as the 2015 Phil Kaufman Award during a presentation and dinner
WHO: Sponsored by the international EDA Consortium (EDAC) and the IEEE Council on Electronic Design Automation (CEDA)
WHEN: Thursday, November 12, beginning at 6:30 p.m. R.S.V.P. until October 30, space permitting.
WHERE: 4th Street Summit Center, 7th Floor, 88 South 4th Street, San Jose, Calif.
Dr. Rhines is being recognized for growing the EDA and integrated circuit (IC) design industries through his efforts as a leading voice of EDA and for pioneering the evolution of IC design to system-on-chip design.
Seating is limited. Dinner reservations are $175 per person for EDAC and IEEE members or $250 per person for non-members. Sponsorships are available. Registration is open until October 30. To register, go to: http://bit.ly/1Oz1Npb
Additionally, EDAC is hosting an upcoming panel, "Patents and Patent Litigation -- Develop, Strengthen, and Protect Your Intellectual Property," an opportunity for executives and engineers of technology companies to learn from the experts. It will be held Thursday, October 29, from 6 p.m. until 9 p.m. at the EDA Consortium/SEMI Global Headquarters, 3081 Zanker Road, San Jose, Calif. This event, the first in a series of panels on legal issues, is open to all EDAC member companies free of charge. Non-EDAC members are welcome to attend based on space availability.
About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across six IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWeek). The Council also publishes IEEE Transactions on Computer Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). In order to promote the recognition of leading EDA professionals, the Council sponsors the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters. For more information on CEDA, visit: www.ieee-ceda.org
About the EDA Consortium
The Electronic Design Automation Consortium, EDAC, is the international association representing companies that develop and provide software tools, services, intellectual property and hardware that make it possible for hardware and software engineers to create the world's electronic products. EDAC's member companies deliver the critical technology and solutions needed to design and verify the semiconductors and associated software, packaging and interconnect technologies that enable the manufacturing of these products. Our member companies impact every conceivable segment of the electronics market, from communications, computers, networking, space technology, medical and industrial equipment to consumer electronics and the emerging IoT (Internet of Things) markets.
Share on:
Suggested Items
Electronic Design Automation Market to Reach $17.47 Billion by 2030, Growing at a CAGR of 10.7%
03/31/2025 | PRNewswireThe growth of the EDA market is driven by the increasing complexity of integrated circuit (IC) designs, rising adoption of connected devices, and growing demand for EDA solutions in the aerospace and defense sectors. Additionally, the increasing integration of AI and machine learning in chip design is further boosting market expansion.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/28/2025 | Andy Shaughnessy, I-Connect007I’ve spent my week recovering from a busy and interesting week in Anaheim for the 25th IPC APEX EXPO. I think back to my first APEX EXPO, and the changes since then are too numerous to count. I first attended in 2004, also in Anaheim, back when there was almost no design content in the conference or expo portions of the show. It was just a few years after the downturn, and attendees and exhibitors alike were skittish, almost afraid to show confidence in our industry. A few unemployed design friends handed out copies of their resumes. Travel budgets were still down, and the aisles weren’t exactly packed with traffic.
It’s Only Common Sense: 7 Tips to Focus on What Works
03/31/2025 | Dan Beaulieu -- Column: It's Only Common SenseIn business, there’s always the temptation to be all things to all people, whether it’s expanding product lines, chasing every lead, or trying to keep up with competitors. The fear of missing out can lead to spreading our time, resources, and energy too thin. However, success doesn’t come from doing everything; it comes from doing the right things well.
HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology
03/27/2025 | PRNewswireThe consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.
GlobalFoundries Certifies Ansys Lumerical Photonic Design Tools for GF Fotonix™ Platform
03/27/2025 | PRNewswireAnsys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform.