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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

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The Marketing Minute: Marketing With Layers

10/15/2025 | Brittany Martin -- Column: The Marketing Minute
Marketing to a technical audience is like crafting a multilayer board: Each layer serves a purpose, from the surface story to the buried detail that keeps everything connected. At I-Connect007, we’ve learned that the best marketing campaigns aren’t built linearly; they’re layered. A campaign might start with a highly technical resource, such as an in-depth article, a white paper, or a podcast featuring an engineer delving into the details of a process. That’s the foundation, the substance that earns credibility.

EDADOC Ushers in a New Era of Robotics Innovation

10/07/2025 | Edy Yu, Editor-in-Chief, ECIO
On Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.

Connect the Dots: Evolution of PCB Manufacturing—Lamination

10/02/2025 | Matt Stevenson -- Column: Connect the Dots
When I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.

Driving Innovation: Mastering Panel Warpage

09/23/2025 | Simon Khesin -- Column: Driving Innovation
During the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.

Beyond Design: Slaying Signal Integrity Villains

09/17/2025 | Barry Olney -- Column: Beyond Design
High-speed PCB design is a balancing act, where subtle oversights can develop into major signal integrity nightmares. Some culprits lie dormant during early validation, only to reveal themselves later through workflow disruptions and elusive performance bottlenecks. Take crosstalk, for example. What begins as a stray signal coupling between traces can ripple through the design, ultimately destabilizing the power distribution network. Each of these troublemakers operates with signature tactics, but they also have well-known vulnerabilities.
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