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Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Sunstone Circuits Launches Customer Case Studies
November 4, 2015 | Sunstone CircuitsEstimated reading time: 1 minute
Sunstone Circuits has recently launched the latest in a series of Customer Case Studies. Find out how Sunstone helped Gentec-EO to be first to market with robust, innovative new products.
"Without Sunstone, I don't know if we could cost-effectively produce the boards we need fast enough to maintain production schedules," said customer Sid Levingston. To read the case study, click here.
Sunstone will also be exhibiting, along with sister company, 3D Fixtures, at Printed Electronics USA 2015. Visit booth #H13 and #H15 to find out how 3D printing can improve prototyping processes.
About Sunstone Circuits
Sunstone Circuits is the established leader in providing innovative and reliable printed circuit board (PCB) solutions for the electronic design industry. With over 40 years of experience in delivering high-quality, on-time PCB prototypes, Sunstone Circuits is committed to improving the prototyping & production process for the design engineer from quote to delivery. With live on-site, e-mail and telephone customer support every day of the year (24/7/365), Sunstone Circuits provides unparalleled customer service and leads the industry with a real On-Time Guarantee that is the first of its kind. For more information about Sunstone's innovative PCB solutions, or to learn more about the online quote and ordering process, please visit www.Sunstone.com. Keep in touch with Sunstone Circuits through social media: YouTube, Facebook, Twitter, LinkedIn & Google+. Or call 1-800-228-8198 or e-mail support@sunstone.com.
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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Connect the Dots: The Future of Designing for Reality—Electroless Copper
11/26/2025 | Matt Stevenson -- Column: Connect the DotsOn a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity.
UHDI Fundamentals: An Overview of UHDI Substrate Materials and Vias
11/13/2025 | Anaya Vardya, American Standard CircuitsThe rapid proliferation of 5G/6G communications, Internet of Things (IoT), high-performance computing (HPC), AI, and medical electronics has driven the need for increasingly compact, high-performance circuit packaging. UHDI, defined by feature sizes well below traditional HDI, addresses these demands by enabling ultra-fine lines, dense via interconnects, and embedded passive functionality. Understanding the materials and layering strategies in UHDI is essential for advancing both manufacturing and application design
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Connect the Dots: Designing for the Reality of UHDI PCBs—Drilling
11/04/2025 | Matt Stevenson -- Column: Connect the DotsUltra high density interconnect (UHDI) PCBs are changing the game in designing for the reality of manufacturing. With both consumer and industrial electronic devices becoming more advanced, the demand for UHDI PCBs will grow. That means we’re all likely to be designing more UHDI boards. UHDI advanced miniaturization technology challenges designers with regard to both board thickness and footprint. Designers will face more variables in every aspect of design creation. This is certainly the case with drilling.
The Marketing Minute: Marketing With Layers
10/15/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing to a technical audience is like crafting a multilayer board: Each layer serves a purpose, from the surface story to the buried detail that keeps everything connected. At I-Connect007, we’ve learned that the best marketing campaigns aren’t built linearly; they’re layered. A campaign might start with a highly technical resource, such as an in-depth article, a white paper, or a podcast featuring an engineer delving into the details of a process. That’s the foundation, the substance that earns credibility.