It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
IPC Standards Committee Reports – Component Traceability, Base Materials, Fabrication Processes, Assembly and Joining
December 1, 2015 | IPCEstimated reading time: 5 minutes
The 5-22arr J-STD-001/Conformal Coating Material & Application Industry Assessment Task Group discussed the current status of round robin testing.
The 5-22as Task Group met to discuss an addendum to 5-22as, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies.
The 5-22f IPC-HDBK-001 Task Group celebrated the completion of the forthcoming revision to IPC-HDBK-001, Handbook and Guide to Supplement J-STD-001, and discussed opening the document for an amendment to address changes as a result of J-STD-001F, Am 1.
The 5-23a Printed Circuit Board Solderability Specifications Task Group reviewed all comments submitted on the Amendment 1 to the J-STD-002D, including the substantial number from Jim Daggett of Raytheon.
The 5-23b Component and Wire Solderability Specification Task Group reviewed some potential changes to J-STD-003C that may just allow the people from DSCC to accept what could be the revision D of this standard.
The 5-24a Flux Specifications Task Group reviewed the SIR test method verification plan, including comparing the current J-STD-004 plan with the IEC round robin plan to determine the test board preparation procedures, specify the testing protocol and set the timing for the testing.
The 5-24b Solder Paste Task Group reviewed testing of solder balls, paste wetting and tackiness (tack) plus discussed rheometry testing using both parallel plate and spiral pump viscometers.
The 5-24c Solder Alloy Task Group discussed the addition of one more patented lead free alloy to J-STD-006; the best way to address the addition of rare earth elements to lead free alloys and then discussed three IPC TM-650 test methods that will be placed in the 5-24c TG KAVI site for additional discussion by members of the task group.
Page 2 of 2Share on:
Suggested Items
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.