Target Condition: Signal Integrity Without Borders
Elementary, Mr. Watson: PCB Education in the Midst of the Storms
Beyond Design: How Signals Survive the Hostile PCB Environment
These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports.
Supplier Declaration
The 2-18h Conflict Minerals Declaration Task Group discussed potential future changes and enhancements to IPC-1755. The committee discussed the use of special characters in smelter names and potential revisions to some of the declaration questions in order to improve clarity and usability. The committee decided to meet monthly work towards publishing a revision of the standard in 2017.
Environment, Health, and Safety
The 4-33 Halogen Free Laminate Materials Subcommittee reviewed what comments from this subcommittee, if any, would be helpful in steering the U.S. EPA in its TSCA work plan to study Tetrabromobisphenol A (TBBPA). Fern Abrams was able to lend some sanity to the discussion and the subcommittee decided to wait for the IPC-constructed comments that will be submitted to the EPA.
Management
The 8-41 Technology Roadmap Subcommittee discussed ways to improve the IPC International Technology Roadmap for Electronic Interconnection and to increase its reach to the greater electronics manufacture industry. From this brainstorming session, the group will strategize the continual awareness of the 2015 version and enhancements which can be made to the 2017 version.
Embedded Devices
Based on significant feedback following publication of IPC-7092, Design and Assembly Process Implementation for Embedded Components, the D-55 Embedded Devices Process Implementation Subcommittee is beginning work on an amendment or A revision of the standard. The subcommittee will make a decision on the best route to take IPC-7092 based on the amount of new information or inquiries for expanded topics it receives.
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