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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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IPC Standards Committee Reports — Supplier Declaration, EH&S, Management, Embedded Devices, Printed Electronics, Conflict MineralsDecember 15, 2015 | IPC
Estimated reading time: 2 minutes
These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports.
The 2-18h Conflict Minerals Declaration Task Group discussed potential future changes and enhancements to IPC-1755. The committee discussed the use of special characters in smelter names and potential revisions to some of the declaration questions in order to improve clarity and usability. The committee decided to meet monthly work towards publishing a revision of the standard in 2017.
Environment, Health, and Safety
The 4-33 Halogen Free Laminate Materials Subcommittee reviewed what comments from this subcommittee, if any, would be helpful in steering the U.S. EPA in its TSCA work plan to study Tetrabromobisphenol A (TBBPA). Fern Abrams was able to lend some sanity to the discussion and the subcommittee decided to wait for the IPC-constructed comments that will be submitted to the EPA.
The 8-41 Technology Roadmap Subcommittee discussed ways to improve the IPC International Technology Roadmap for Electronic Interconnection and to increase its reach to the greater electronics manufacture industry. From this brainstorming session, the group will strategize the continual awareness of the 2015 version and enhancements which can be made to the 2017 version.
Based on significant feedback following publication of IPC-7092, Design and Assembly Process Implementation for Embedded Components, the D-55 Embedded Devices Process Implementation Subcommittee is beginning work on an amendment or A revision of the standard. The subcommittee will make a decision on the best route to take IPC-7092 based on the amount of new information or inquiries for expanded topics it receives.
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ROCKA Solutions is excited to announce that Justin Worden, Vice President of Sales & Marketing, will present at the upcoming SMTA Dallas Expo & Tech Forum. The event is scheduled to take place Tuesday, March 19, 2024 at the Plano Event Center.
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is thrilled to announce the premier of a new online video series “Ask Dr. Adam.”
I-Connect007 has just released the latest episode of its podcast series, On the Line with..., which focuses on designing for reality in the electronics industry. In this episode, host Nolan Johnson talks with ASC Sunstone VP/Manager Matt Stevenson about CAD tool features and data formats that help designers make better decisions and transfer better designs to manufacturing.
TT Electronics, a leading provider of global manufacturing solutions and engineered technologies, proudly announces the grand opening of its newest manufacturing facility located in Mexicali, Mexico.
NEOTech Launches World-Class NPI and Electronics Manufacturing Center of Excellence in Silicon Valley, Northern CA02/20/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is excited to announce the upcoming launch of a state-of-the-art New Product Introduction (NPI) and electronics manufacturing center of excellence at its Fremont, CA facility.